Inventor
NAGENGAST ANDREW
US15 patents
⚠️ This page may combine multiple inventors who share the name “NAGENGAST ANDREW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
11 patentsUS7527271B2May 5, 2009
Fast substrate loading on polishing head without membrane inflation step
APPLIED MATERIALS INC32 citations92
US6592439B1Jul 15, 2003
Platen for retaining polishing material
APPLIED MATERIALS INC22 citations90
US11400560B2Aug 2, 2022
Retaining ring design
APPLIED MATERIALS INC6 citations74
US11623321B2Apr 11, 2023
Polishing head retaining ring tilting moment control
APPLIED MATERIALS INC2 citations73
US9610672B2Apr 4, 2017
Configurable pressure design for multizone chemical mechanical planarization polishing head
APPLIED MATERIALS INC5 citations73
US6739958B2May 25, 2004
Carrier head with a vibration reduction feature for a chemical mechanical polishing system
APPLIED MATERIALS INC10 citations71
US12251788B2Mar 18, 2025
Polishing head with local wafer pressure
APPLIED MATERIALS INC0 citations62
US12214469B2Feb 4, 2025
Polishing head retaining ring tilting moment control
APPLIED MATERIALS INC0 citations62
US11986923B2May 21, 2024
Polishing head with local wafer pressure
APPLIED MATERIALS INC0 citations62
US11904429B2Feb 20, 2024
Substrate polishing apparatus with contact extension or adjustable stop
APPLIED MATERIALS INC0 citations62
US11660721B2May 30, 2023
Dual loading retaining ring
APPLIED MATERIALS INC0 citations62
LAM RES CORP
4 patentsUS6132289AOct 17, 2000
Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
LAM RES CORP101 citations94
US6328637B1Dec 11, 2001
Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
LAM RES CORP17 citations90
US6086460AJul 11, 2000
Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
LAM RES CORP41 citations90
US6425812B1Jul 30, 2002
Polishing head for chemical mechanical polishing using linear planarization technology
LAM RES CORP13 citations73