Inventor
LIN TA-YANG
TW5 patents
Patents
5 patentsUS6486054B1Nov 26, 2002
Method to achieve robust solder bump height
TAIWAN SEMICONDUCTOR MFG25 citations91
US6624060B2Sep 23, 2003
Method and apparatus for pretreating a substrate prior to electroplating
TAIWAN SEMICONDUCTOR MFG22 citations90
US6696356B2Feb 24, 2004
Method of making a bump on a substrate without ribbon residue
TAIWAN SEMICONDUCTOR MFG23 citations89
US6941957B2Sep 13, 2005
Method and apparatus for pretreating a substrate prior to electroplating
TAIWAN SEMICONDUCTOR MFG4 citations60
US6784002B1Aug 31, 2004
Method to make wafer laser marks visable after bumping process
TAIWAN SEMICONDUCTOR MFG1 citations43