Inventor
TANGPUZ CONSUELO
PH5 patents
Patents
5 patentsUS6731003B2May 4, 2004
Wafer-level coated copper stud bumps
FAIRCHILD SEMICONDUCTOR279 citations98
US7271497B2Sep 18, 2007
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR110 citations97
US6391687B1May 21, 2002
Column ball grid array package
FAIRCHILD SEMICONDUCTOR68 citations90
US7501337B2Mar 10, 2009
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR7 citations72
US7932171B2Apr 26, 2011
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR2 citations61