Inventor
CRUZ ERWIN VICTOR R
PH11 patents
⚠️ This page may combine multiple inventors who share the name “CRUZ ERWIN VICTOR R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
8 patentsUS6731003B2May 4, 2004
Wafer-level coated copper stud bumps
FAIRCHILD SEMICONDUCTOR279 citations98
US7271497B2Sep 18, 2007
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR110 citations97
US6943434B2Sep 13, 2005
Method for maintaining solder thickness in flipchip attach packaging processes
FAIRCHILD SEMICONDUCTOR133 citations97
US7285849B2Oct 23, 2007
Semiconductor die package using leadframe and clip and method of manufacturing
FAIRCHILD SEMICONDUCTOR114 citations96
US7972906B2Jul 5, 2011
Semiconductor die package including exposed connections
FAIRCHILD SEMICONDUCTOR10 citations83
US7501337B2Mar 10, 2009
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR7 citations72
US7402462B2Jul 22, 2008
Folded frame carrier for MOSFET BGA
FAIRCHILD SEMICONDUCTOR8 citations65
US7932171B2Apr 26, 2011
Dual metal stud bumping for flip chip applications
FAIRCHILD SEMICONDUCTOR2 citations61