Inventor
SAKAMOTO HAJIME
JP39 patents
⚠️ This page may combine multiple inventors who share the name “SAKAMOTO HAJIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
22 patentsUS7435910B2Oct 14, 2008
Multilayer printed circuit board
IBIDEN CO LTD63 citations99
US6909054B2Jun 21, 2005
Multilayer printed wiring board and method for producing multilayer printed wiring board
IBIDEN CO LTD131 citations99
US7852634B2Dec 14, 2010
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD55 citations98
US6889433B1May 10, 2005
Method of manufacturing printed-circuit board
IBIDEN CO LTD81 citations98
US7855342B2Dec 21, 2010
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD29 citations96
US7842887B2Nov 30, 2010
Multilayer printed circuit board
IBIDEN CO LTD45 citations96
US7893360B2Feb 22, 2011
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD18 citations93
US7888606B2Feb 15, 2011
Multilayer printed circuit board
IBIDEN CO LTD14 citations93
US9893016B2Feb 13, 2018
Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same
IBIDEN CO LTD8 citations84
US9245838B2Jan 26, 2016
Semiconductor element
IBIDEN CO LTD3 citations84
US8046914B2Nov 1, 2011
Method for manufacturing multilayer printed circuit board
IBIDEN CO LTD4 citations74
US7999387B2Aug 16, 2011
Semiconductor element connected to printed circuit board
IBIDEN CO LTD5 citations74
US7908745B2Mar 22, 2011
Method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD6 citations74
US7888605B2Feb 15, 2011
Multilayer printed circuit board
IBIDEN CO LTD3 citations74
US7884286B2Feb 8, 2011
Multilayer printed circuit board
IBIDEN CO LTD5 citations74
US10186486B2Jan 22, 2019
Wiring board
IBIDEN CO LTD2 citations73
US10090238B2Oct 2, 2018
Wiring substrate and method for manufacturing the same
IBIDEN CO LTD2 citations73
US9837342B2Dec 5, 2017
Multilayer wiring board and method for manufacturing same
IBIDEN CO LTD5 citations73
US9706663B2Jul 11, 2017
Printed wiring board, method for manufacturing the same and semiconductor device
IBIDEN CO LTD4 citations73
US9711439B2Jul 18, 2017
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations72
US7662694B2Feb 16, 2010
Capacitor having adjustable capacitance, and printed wiring board having the same
IBIDEN CO LTD3 citations63
US10804191B2Oct 13, 2020
Printed wiring board
IBIDEN CO LTD1 citations62
SAKAMOTO HAJIME
13 patentsUS8453323B2Jun 4, 2013
Printed circuit board manufacturing method
SAKAMOTO HAJIME12 citations92
US8186045B2May 29, 2012
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME14 citations92
US8079142B2Dec 20, 2011
Printed circuit board manufacturing method
SAKAMOTO HAJIME15 citations92
US8067699B2Nov 29, 2011
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME8 citations92
US8959756B2Feb 24, 2015
Method of manufacturing a printed circuit board having an embedded electronic component
SAKAMOTO HAJIME6 citations84
US8822323B2Sep 2, 2014
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
US8524535B2Sep 3, 2013
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME6 citations84
US8438727B2May 14, 2013
Multilayer printed circuit board and multilayer printed circuit board manufacturing method
SAKAMOTO HAJIME2 citations74
US8293579B2Oct 23, 2012
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
SAKAMOTO HAJIME4 citations74
US8058563B2Nov 15, 2011
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations63
US8188378B2May 29, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations62
US8997344B2Apr 7, 2015
Method for manufacturing interposer
SAKAMOTO HAJIME0 citations52
US8173907B2May 8, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME0 citations52