Inventor
ENG CHUNG-PING
US5 patents
Patents
5 patentsUS7138717B2Nov 21, 2006
HDP-based ILD capping layer
IBM19 citations91
US6387790B1May 14, 2002
Conversion of amorphous layer produced during IMP Ti deposition
IBM19 citations89
US7008803B2Mar 7, 2006
Method of reworking structures incorporating low-k dielectric materials
IBM14 citations78
US7372158B2May 13, 2008
HDP-based ILD capping layer
IBM8 citations72
US6436823B1Aug 20, 2002
Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed
IBM7 citations71