Inventor
ORIKABE HIROSHI
JP7 patents
Patents
7 patentsUS6335417B1Jan 1, 2002
Modified polyimide resin and thermosetting resin composition containing the same
AJINOMOTO KK29 citations91
US6232426B1May 15, 2001
Epoxy resin composition
AJINOMOTO KK30 citations91
US6818702B1Nov 16, 2004
Thermosetting resin composition and flexible circuit overcoating material comprising the same
AJINOMOTO KK11 citations73
US6380343B1Apr 30, 2002
Curable resin composition for overcoat of flexible circuit
AJINOMOTO KK9 citations72
US6162889ADec 19, 2000
Curable resin composition for overcoat of flexible circuit
AJINOMOTO KK15 citations72
US7282257B2Oct 16, 2007
Resin composition and adhesive film for multi-layered printing wiring board
AJINOMOTO KK4 citations62
US6433123B2Aug 13, 2002
Curable resin composition for overcoat of flexible circuit
AJINOMOTO KK1 citations50