P

Inventor

CARRUTHERS ROY A

US21 patents
⚠️ This page may combine multiple inventors who share the name “CARRUTHERS ROY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

17 patents
US7449782B2Nov 11, 2008

Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby

IBM16 citations92
US7384868B2Jun 10, 2008

Reduction of silicide formation temperature on SiGe containing substrates

IBM18 citations92
US6690072B2Feb 10, 2004

Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned COSI2 on raised source drain Si/SiGe device

IBM16 citations92
US7598516B2Oct 6, 2009

Self-aligned process for nanotube/nanowire FETs

IBM24 citations91
US7247946B2Jul 24, 2007

On-chip Cu interconnection using 1 to 5 nm thick metal cap

IBM35 citations91
US5340775AAug 23, 1994

Structure and fabrication of SiCr microfuses

IBM40 citations89
US6972250B2Dec 6, 2005

Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned CoSi2 on raised source drain Si/SiGe device

IBM16 citations84
US8003453B2Aug 23, 2011

Self-aligned process for nanotube/nanowire FETs

IBM11 citations83
US7517795B2Apr 14, 2009

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

IBM9 citations81
US7119012B2Oct 10, 2006

Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation

IBM14 citations81
US5285099AFeb 8, 1994

SiCr microfuses

IBM17 citations79
US7271486B2Sep 18, 2007

Retarding agglomeration of Ni monosilicide using Ni alloys

IBM7 citations74
US6905560B2Jun 14, 2005

Retarding agglomeration of Ni monosilicide using Ni alloys

IBM10 citations74
US6417567B1Jul 9, 2002

Flat interface for a metal-silicon contract barrier film

IBM8 citations74
US7682968B2Mar 23, 2010

Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby

IBM1 citations62
US7784669B2Aug 31, 2010

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

IBM1 citations49
US7703661B2Apr 27, 2010

Method and process for reducing undercooling in a lead-free tin-rich solder alloy

IBM1 citations49

CABRAL JR CYRIL

2 patents

AVOURIS PHAEDON

1 patent

BOL AGEETH A

1 patent