Inventor
CARRUTHERS ROY A
US21 patents
⚠️ This page may combine multiple inventors who share the name “CARRUTHERS ROY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS7449782B2Nov 11, 2008
Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby
IBM16 citations92
US7384868B2Jun 10, 2008
Reduction of silicide formation temperature on SiGe containing substrates
IBM18 citations92
US6690072B2Feb 10, 2004
Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned COSI2 on raised source drain Si/SiGe device
IBM16 citations92
US7598516B2Oct 6, 2009
Self-aligned process for nanotube/nanowire FETs
IBM24 citations91
US7247946B2Jul 24, 2007
On-chip Cu interconnection using 1 to 5 nm thick metal cap
IBM35 citations91
US5340775AAug 23, 1994
Structure and fabrication of SiCr microfuses
IBM40 citations89
US6972250B2Dec 6, 2005
Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned CoSi2 on raised source drain Si/SiGe device
IBM16 citations84
US8003453B2Aug 23, 2011
Self-aligned process for nanotube/nanowire FETs
IBM11 citations83
US7517795B2Apr 14, 2009
Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation
IBM9 citations81
US7119012B2Oct 10, 2006
Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation
IBM14 citations81
US5285099AFeb 8, 1994
SiCr microfuses
IBM17 citations79
US7271486B2Sep 18, 2007
Retarding agglomeration of Ni monosilicide using Ni alloys
IBM7 citations74
US6905560B2Jun 14, 2005
Retarding agglomeration of Ni monosilicide using Ni alloys
IBM10 citations74
US6417567B1Jul 9, 2002
Flat interface for a metal-silicon contract barrier film
IBM8 citations74
US7682968B2Mar 23, 2010
Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby
IBM1 citations62
US7784669B2Aug 31, 2010
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
IBM1 citations49
US7703661B2Apr 27, 2010
Method and process for reducing undercooling in a lead-free tin-rich solder alloy
IBM1 citations49