Inventor

RIEDL EDMUND

DE28 patents

⚠️ This page may combine multiple inventors who share the name “RIEDL EDMUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RIEDL EDMUND

INFINEON TECHNOLOGIES AG

Connection device and method for producing the same

Diffusion solder position, and process for producing it

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations

Diffusion soldered semiconductor device

Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer

Metal article intended for at least partially coating with a substance and a method for producing the same

Method of manufacturing a package having an adhesion promoter

Inorganic encapsulant for electronic component with adhesion promoter

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Semiconductor device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Semiconductor chip arrangement and method

Chip arrangements

Soldering a conductor to an aluminum metallization

Semiconductor package

Method of making an integrated circuit including electrodeposition of metallic chromium

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

Connection member with bulk body and electrically and thermally conductive coating

Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement

RIEDL EDMUND

Semiconductor package and method of assembling a semiconductor package

Method for producing a metal article intended for at least partially coating with a substance

Method of fabricating a semiconductor device

HEINRICH ALEXANDER

Bonding material with exothermically reactive heterostructures

SCHNEEGANS MANFRED

Semiconductor device

MENGEL MANFRED

Solder alloys and arrangements