Inventor
JORDAN STEFFEN
DE10 patents
⚠️ This page may combine multiple inventors who share the name “JORDAN STEFFEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS11862600B2Jan 2, 2024
Method of forming a chip package and chip package
INFINEON TECHNOLOGIES AG2 citations72
US12288727B2Apr 29, 2025
Method of manufacturing a package having an adhesion promoter
INFINEON TECHNOLOGIES AG0 citations61
US11652012B2May 16, 2023
Inorganic encapsulant for electronic component with adhesion promoter
INFINEON TECHNOLOGIES AG0 citations61
US10229885B2Mar 12, 2019
Method of galvanic plating assisted by a current distribution layer
INFINEON TECHNOLOGIES AG0 citations51
US7989930B2Aug 2, 2011
Semiconductor package
INFINEON TECHNOLOGIES AG0 citations51
US10229891B2Mar 12, 2019
Chip embedding package with solderable electric contact
INFINEON TECHNOLOGIES AG0 citations41
US10366924B2Jul 30, 2019
Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance
INFINEON TECHNOLOGIES AG0 citations40