Inventor
HWANG SEONG-DEOK
KR29 patents
⚠️ This page may combine multiple inventors who share the name “HWANG SEONG-DEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS7626260B2Dec 1, 2009
Stack-type semiconductor device having cooling path on its bottom surface
SAMSUNG ELECTRONICS CO LTD9 citations84
US9065033B2Jun 23, 2015
Light emitting device package
SAMSUNG ELECTRONICS CO LTD14 citations82
US8896078B2Nov 25, 2014
Light emitting apparatus
SAMSUNG ELECTRONICS CO LTD12 citations80
US7544538B2Jun 9, 2009
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US8809888B2Aug 19, 2014
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
SAMSUNG ELECTRONICS CO LTD4 citations73
US9472722B1Oct 18, 2016
Light emitting device package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD1 citations63
US8039937B2Oct 18, 2011
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7847416B2Dec 7, 2010
Wafer level package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US9577147B2Feb 21, 2017
Light emitting device package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US9269877B2Feb 23, 2016
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
SAMSUNG ELECTRONICS CO LTD0 citations52
US8722435B2May 13, 2014
Light emitting device package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7851256B2Dec 14, 2010
Method of manufacturing chip-on-chip semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US9691957B2Jun 27, 2017
Light emitting device package
SAMSUNG ELECTRONICS CO LTD1 citations50
US9165817B2Oct 20, 2015
Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US7969024B2Jun 28, 2011
Semiconductor package with joint reliability, entangled wires including insulating material
SAMSUNG ELECTRONICS CO LTD1 citations48
KIM YU-SIK
4 patentsUS8178424B2May 15, 2012
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
KIM YU-SIK5 citations74
US8415181B2Apr 9, 2013
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
KIM YU-SIK2 citations63
US8110843B2Feb 7, 2012
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
KIM YU-SIK1 citations63
US8637881B2Jan 28, 2014
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
KIM YU-SIK0 citations52