Inventor
PHUA YOKE HOR
SG6 patents
⚠️ This page may combine multiple inventors who share the name “PHUA YOKE HOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JCET SEMICONDUCTOR SHAOXING CO LTD
3 patentsUS10916482B2Feb 9, 2021
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations59
US12148677B2Nov 19, 2024
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
US11227809B2Jan 18, 2022
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
PHUA YOKE HOR
2 patentsUS8524577B2Sep 3, 2013
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure
PHUA YOKE HOR7 citations78
US8513098B2Aug 20, 2013
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure
PHUA YOKE HOR0 citations36