Inventor
HSIAO YUNG KUAN
SG19 patents
⚠️ This page may combine multiple inventors who share the name “HSIAO YUNG KUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
8 patentsUS5985765ANov 16, 1999
Method for reducing bonding pad loss using a capping layer when etching bonding pad passivation openings
TAIWAN SEMICONDUCTOR MFG78 citations96
US6444584B1Sep 3, 2002
Plasma etch method for forming composite silicon/dielectric/silicon stack layer
TAIWAN SEMICONDUCTOR MFG21 citations92
US6004857ADec 21, 1999
Method to increase DRAM capacitor via rough surface storage node plate
TAIWAN SEMICONDUCTOR MFG51 citations92
US7446398B2Nov 4, 2008
Bump pattern design for flip chip semiconductor package
TAIWAN SEMICONDUCTOR MFG15 citations82
US6140218AOct 31, 2000
Method for fabricating a T-shaped hard mask/conductor profile to improve self-aligned contact isolation
TAIWAN SEMICONDUCTOR MFG12 citations74
US6107155AAug 22, 2000
Method for making a more reliable storage capacitor for dynamic random access memory (DRAM)
TAIWAN SEMICONDUCTOR MFG8 citations74
US6077778AJun 20, 2000
Method of improving refresh time in DRAM products
TAIWAN SEMICONDUCTOR MFG8 citations74
US6030879AFeb 29, 2000
Method of reducing particles during the manufacturing of fin or cylinder capacitors on a wafer
TAIWAN SEMICONDUCTOR MFG12 citations69
JCET SEMICONDUCTOR SHAOXING CO LTD
3 patentsUS10916482B2Feb 9, 2021
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations59
US12148677B2Nov 19, 2024
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
US11227809B2Jan 18, 2022
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
PHUA YOKE HOR
2 patentsUS8524577B2Sep 3, 2013
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure
PHUA YOKE HOR7 citations78
US8513098B2Aug 20, 2013
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure
PHUA YOKE HOR0 citations36