Inventor
HIRATA KAZUYA
JP88 patents
⚠️ This page may combine multiple inventors who share the name “HIRATA KAZUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
45 patentsUS10155323B2Dec 18, 2018
SiC wafer producing method
DISCO CORP22 citations94
US9925619B2Mar 27, 2018
Wafer producing method
DISCO CORP23 citations94
US9878397B2Jan 30, 2018
SiC wafer producing method
DISCO CORP50 citations94
US9868177B2Jan 16, 2018
Wafer producing method
DISCO CORP36 citations94
US9815138B2Nov 14, 2017
Wafer producing method
DISCO CORP26 citations94
US9789565B2Oct 17, 2017
Wafer producing method
DISCO CORP28 citations94
US9620415B2Apr 11, 2017
Wafer processing method
DISCO CORP49 citations94
US9517530B2Dec 13, 2016
Wafer producing method
DISCO CORP31 citations94
US9481051B2Nov 1, 2016
Wafer producing method
DISCO CORP48 citations94
US11958132B2Apr 16, 2024
SiC ingot processing method and laser processing apparatus
DISCO CORP10 citations86
US10870176B2Dec 22, 2020
SiC wafer producing method
DISCO CORP16 citations86
US10357851B2Jul 23, 2019
Wafer producing method
DISCO CORP15 citations86
US10406635B2Sep 10, 2019
Wafer producing method and processing feed direction detecting method
DISCO CORP13 citations84
US10201907B2Feb 12, 2019
SiC wafer producting method
DISCO CORP12 citations84
US9981339B2May 29, 2018
Wafer producing method
DISCO CORP8 citations84
US9884389B2Feb 6, 2018
SiC ingot slicing method
DISCO CORP7 citations84
US9808884B2Nov 7, 2017
Polycrystalline SiC wafer producing method
DISCO CORP16 citations84
US9764420B2Sep 19, 2017
Wafer producing method
DISCO CORP14 citations84
US9764428B2Sep 19, 2017
Wafer producing method
DISCO CORP15 citations84
US11534890B2Dec 27, 2022
SiC ingot forming method
DISCO CORP2 citations73
US11469094B2Oct 11, 2022
Method of producing wafer
DISCO CORP2 citations73
US10872758B2Dec 22, 2020
SiC wafer producing method
DISCO CORP4 citations73
US10872757B2Dec 22, 2020
Semiconductor substrate processing method
DISCO CORP4 citations73
US10828726B2Nov 10, 2020
SiC wafer producing method using ultrasonic wave
DISCO CORP6 citations73
US10755946B2Aug 25, 2020
Method for producing a wafer from a hexagonal single crystal ingot by applying a laser beam to form a first production history, an exfoliation layer, and a second production history
DISCO CORP6 citations73
US10625371B2Apr 21, 2020
Wafer producing method
DISCO CORP2 citations73
US10573505B2Feb 25, 2020
SiC wafer producing method
DISCO CORP6 citations73
US10319594B2Jun 11, 2019
Wafer thinning method
DISCO CORP4 citations73
US10112256B2Oct 30, 2018
SiC wafer producing method
DISCO CORP4 citations73
US10105792B2Oct 23, 2018
SiC substrate separating method
DISCO CORP4 citations73
US10094047B2Oct 9, 2018
Wafer producing method
DISCO CORP2 citations73
US10076804B2Sep 18, 2018
Wafer producing method
DISCO CORP3 citations73
US10071442B2Sep 11, 2018
Laser processing apparatus
DISCO CORP3 citations73
US9975202B2May 22, 2018
Method of producing SiC wafer
DISCO CORP3 citations73
US9941130B2Apr 10, 2018
Thin plate separating method
DISCO CORP3 citations73
US9899262B2Feb 20, 2018
Wafer processing method
DISCO CORP4 citations73
US9884390B2Feb 6, 2018
Wafer producing method
DISCO CORP2 citations73
US10319593B2Jun 11, 2019
Wafer thinning method
DISCO CORP6 citations72
US10916460B2Feb 9, 2021
Wafer producing apparatus
DISCO CORP2 citations71
US11901231B2Feb 13, 2024
Separation method of wafer
DISCO CORP2 citations70
US11340163B2May 24, 2022
Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatus
DISCO CORP2 citations70
US10081076B2Sep 25, 2018
Wafer producing method
DISCO CORP4 citations70
US11597039B2Mar 7, 2023
Wafer producing method and laser processing apparatus
DISCO CORP0 citations63
US11273522B2Mar 15, 2022
Wafer producing method and laser processing apparatus
DISCO CORP0 citations63
US10369659B2Aug 6, 2019
Wafer producing method
DISCO CORP1 citations62
EBARA CORP
2 patentsNISSAN TECH CT NORTH AMERICA
1 patentDENSO CORP
1 patentKOBE STEEL LTD
1 patentShowing the top 50 of 88 patents by PatentIndex Score.