Inventor
NISHINO YOKO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “NISHINO YOKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
19 patentsUS9925619B2Mar 27, 2018
Wafer producing method
DISCO CORP23 citations94
US9789565B2Oct 17, 2017
Wafer producing method
DISCO CORP28 citations94
US9620415B2Apr 11, 2017
Wafer processing method
DISCO CORP49 citations94
US9517530B2Dec 13, 2016
Wafer producing method
DISCO CORP31 citations94
US9481051B2Nov 1, 2016
Wafer producing method
DISCO CORP48 citations94
US10357851B2Jul 23, 2019
Wafer producing method
DISCO CORP15 citations86
US9884389B2Feb 6, 2018
SiC ingot slicing method
DISCO CORP7 citations84
US9808884B2Nov 7, 2017
Polycrystalline SiC wafer producing method
DISCO CORP16 citations84
US9764420B2Sep 19, 2017
Wafer producing method
DISCO CORP14 citations84
US9764428B2Sep 19, 2017
Wafer producing method
DISCO CORP15 citations84
US9174305B2Nov 3, 2015
Laser processing apparatus including plasma detecting means
DISCO CORP14 citations84
US10625371B2Apr 21, 2020
Wafer producing method
DISCO CORP2 citations73
US10076804B2Sep 18, 2018
Wafer producing method
DISCO CORP3 citations73
US9899262B2Feb 20, 2018
Wafer processing method
DISCO CORP4 citations73
US9884390B2Feb 6, 2018
Wafer producing method
DISCO CORP2 citations73
US10319593B2Jun 11, 2019
Wafer thinning method
DISCO CORP6 citations72
US10081076B2Sep 25, 2018
Wafer producing method
DISCO CORP4 citations70
US10369659B2Aug 6, 2019
Wafer producing method
DISCO CORP1 citations62
US10297438B2May 21, 2019
Water producing method
DISCO CORP0 citations42
MORIKAZU HIROSHI
3 patentsUS9193008B2Nov 24, 2015
Laser processing method and laser processing apparatus
MORIKAZU HIROSHI14 citations84
US9174306B2Nov 3, 2015
Laser processing method for nonlinear crystal substrate
MORIKAZU HIROSHI0 citations51
US8759195B2Jun 24, 2014
Optical device wafer processing method
MORIKAZU HIROSHI1 citations51