Inventor
POLIKS MARK D
US36 patents
⚠️ This page may combine multiple inventors who share the name “POLIKS MARK D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS7301108B2Nov 27, 2007
Multi-layered interconnect structure using liquid crystalline polymer dielectric
IBM105 citations99
US6465084B1Oct 15, 2002
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM116 citations99
US6329603B1Dec 11, 2001
Low CTE power and ground planes
IBM135 citations99
US6929900B2Aug 16, 2005
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM127 citations98
US6613413B1Sep 2, 2003
Porous power and ground planes for reduced PCB delamination and better reliability
IBM76 citations98
US6600224B1Jul 29, 2003
Thin film attachment to laminate using a dendritic interconnection
IBM83 citations98
US6686539B2Feb 3, 2004
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM109 citations97
US5194930AMar 16, 1993
Dielectric composition and solder interconnection structure for its use
IBM143 citations97
US6826830B2Dec 7, 2004
Multi-layered interconnect structure using liquid crystalline polymer dielectric
IBM42 citations96
US6722031B2Apr 20, 2004
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
IBM53 citations96
US6254972B1Jul 3, 2001
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
IBM29 citations93
US6207595B1Mar 27, 2001
Laminate and method of manufacture thereof
IBM59 citations93
US6944946B2Sep 20, 2005
Porous power and ground planes for reduced PCB delamination and better reliability
IBM21 citations92
US6645607B2Nov 11, 2003
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM24 citations92
US6534179B2Mar 18, 2003
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
IBM25 citations92
US7777136B2Aug 17, 2010
Multi-layered interconnect structure using liquid crystalline polymer dielectric
IBM5 citations74
US6967705B2Nov 22, 2005
Lamination of liquid crystal polymer dielectric films
IBM6 citations74
US7981245B2Jul 19, 2011
Multi-layered interconnect structure using liquid crystalline polymer dielectric
IBM4 citations63
US7402254B2Jul 22, 2008
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
IBM4 citations63
US7014731B2Mar 21, 2006
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
IBM2 citations63
US6819373B2Nov 16, 2004
Lamination of liquid crystal polymer dielectric films
IBM2 citations63
US6534160B2Mar 18, 2003
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
IBM3 citations63
ENDICOTT INTERCONNECT TECH INC
5 patentsUS7541058B2Jun 2, 2009
Method of making circuitized substrate with internal optical pathway
ENDICOTT INTERCONNECT TECH INC20 citations93
US7025607B1Apr 11, 2006
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
ENDICOTT INTERCONNECT TECH INC51 citations93
US7713767B2May 11, 2010
Method of making circuitized substrate with internal optical pathway using photolithography
ENDICOTT INTERCONNECT TECH INC13 citations84
US7646098B2Jan 12, 2010
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
ENDICOTT INTERCONNECT TECH INC9 citations84
US7541265B2Jun 2, 2009
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate
ENDICOTT INTERCONNECT TECH INC12 citations84
UNIV NEW YORK STATE RES FOUND
4 patentsUS9606245B1Mar 28, 2017
Autonomous gamma, X-ray, and particle detector
UNIV NEW YORK STATE RES FOUND88 citations95
US9835737B1Dec 5, 2017
Autonomous gamma, X-ray, and particle detector
UNIV NEW YORK STATE RES FOUND13 citations81
US11331019B2May 17, 2022
Nanoparticle sensor having a nanofibrous membrane scaffold
UNIV NEW YORK STATE RES FOUND0 citations61
US10064283B2Aug 28, 2018
Embedded thin films
UNIV NEW YORK STATE RES FOUND0 citations46