Inventor
MAYUZUMI SATORU
US24 patents
⚠️ This page may combine multiple inventors who share the name “MAYUZUMI SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
11 patentsUS9337305B2May 10, 2016
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP6 citations83
US10199227B2Feb 5, 2019
Method for fabricating a metal high-k gate stack for a buried recessed access device
SONY CORP3 citations73
US8779546B1Jul 15, 2014
Semiconductor memory system with bit line and method of manufacture thereof
SONY CORP3 citations62
US9337042B2May 10, 2016
Method for fabricating a metal high-k gate stack for a buried recessed access device
SONY CORP0 citations52
US8980713B2Mar 17, 2015
Method for fabricating a metal high-k gate stack for a buried recessed access device
SONY CORP0 citations52
US10868177B2Dec 15, 2020
Semiconductor device and manufacturing method thereof
SONY CORP0 citations51
US10854751B2Dec 1, 2020
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP0 citations51
US10535769B2Jan 14, 2020
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP0 citations51
US10269961B2Apr 23, 2019
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP0 citations51
US9947790B2Apr 17, 2018
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP0 citations51
US9601622B2Mar 21, 2017
Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
SONY CORP0 citations51
SANDISK TECHNOLOGIES LLC
3 patentsUS10833101B2Nov 10, 2020
Three-dimensional memory device with horizontal silicon channels and method of making the same
SANDISK TECHNOLOGIES LLC20 citations93
US10381366B1Aug 13, 2019
Air gap three-dimensional cross rail memory device and method of making thereof
SANDISK TECHNOLOGIES LLC21 citations92
US10748966B2Aug 18, 2020
Three-dimensional memory device containing cobalt capped copper lines and method of making the same
SANDISK TECHNOLOGIES LLC4 citations73
NEC ELECTRONICS CORP
2 patentsMAYUZUMI SATORU
2 patentsUS8896068B2Nov 25, 2014
Semiconductor device including source/drain regions and a gate electrode, and having contact portions
MAYUZUMI SATORU27 citations90
US9153663B2Oct 6, 2015
Semiconductor device having a stress-inducing layer between channel region and source and drain regions
MAYUZUMI SATORU0 citations49