Inventor
IACOPONI JOHN
US11 patents
⚠️ This page may combine multiple inventors who share the name “IACOPONI JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
4 patentsUS8753975B1Jun 17, 2014
Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting device
GLOBALFOUNDRIES INC10 citations83
US9087881B2Jul 21, 2015
Electroless fill of trench in semiconductor structure
GLOBALFOUNDRIES INC4 citations72
US9318436B2Apr 19, 2016
Copper based nitride liner passivation layers for conductive copper structures
GLOBALFOUNDRIES INC0 citations51
US8859419B2Oct 14, 2014
Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device
GLOBALFOUNDRIES INC1 citations51
ADVANCED MICRO DEVICES INC
3 patentsUS7759205B1Jul 20, 2010
Methods for fabricating semiconductor devices minimizing under-oxide regrowth
ADVANCED MICRO DEVICES INC9 citations83
US6110345AAug 29, 2000
Method and system for plating workpieces
ADVANCED MICRO DEVICES INC16 citations82
US6200913B1Mar 13, 2001
Cure process for manufacture of low dielectric constant interlevel dielectric layers
ADVANCED MICRO DEVICES INC9 citations74