Inventor
BLACKSHEAR EDMUND
US14 patents
⚠️ This page may combine multiple inventors who share the name “BLACKSHEAR EDMUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS7174233B1Feb 6, 2007
Quality/reliability system and method in multilevel manufacturing environment
IBM20 citations88
US8378498B2Feb 19, 2013
Chip assembly with a coreless substrate employing a patterned adhesive layer
IBM10 citations83
US9743526B1Aug 22, 2017
Wiring board with stacked embedded capacitors and method of making
IBM8 citations78
US9040388B2May 26, 2015
Chip assembly with a coreless substrate employing a patterned adhesive layer
IBM4 citations72
US9093563B2Jul 28, 2015
Electronic module assembly with patterned adhesive array
IBM4 citations71
US9818682B2Nov 14, 2017
Laminate substrates having radial cut metallic planes
IBM1 citations51
US11342697B2May 24, 2022
Dual-level pad card edge self-guide and alignment of connector
IBM0 citations50
GLOBALFOUNDRIES INC
4 patentsUS9659131B2May 23, 2017
Copper feature design for warpage control of substrates
GLOBALFOUNDRIES INC3 citations71
US9305894B2Apr 5, 2016
Constrained die adhesion cure process
GLOBALFOUNDRIES INC3 citations71
US9543253B2Jan 10, 2017
Method for shaping a laminate substrate
GLOBALFOUNDRIES INC1 citations51
US9293439B2Mar 22, 2016
Electronic module assembly with patterned adhesive array
GLOBALFOUNDRIES INC0 citations51