Inventor
INTERRANTE MARCUS E
US11 patents
⚠️ This page may combine multiple inventors who share the name “INTERRANTE MARCUS E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS10541156B1Jan 21, 2020
Multi integrated circuit chip carrier package
IBM16 citations92
US9583408B1Feb 28, 2017
Reducing directional stress in an orthotropic encapsulation member of an electronic package
IBM3 citations73
US10804181B2Oct 13, 2020
Heterogeneous thermal interface material for corner and or edge degradation mitigation
IBM2 citations72
US9093563B2Jul 28, 2015
Electronic module assembly with patterned adhesive array
IBM4 citations71
US10978314B2Apr 13, 2021
Multi integrated circuit chip carrier package
IBM0 citations61
US10832987B2Nov 10, 2020
Managing thermal warpage of a laminate
IBM0 citations52
US11164804B2Nov 2, 2021
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste
IBM0 citations47
US9224712B2Dec 29, 2015
3D bond and assembly process for severely bowed interposer die
IBM0 citations41