Inventor
PARK JAE MAN
KR41 patents
⚠️ This page may combine multiple inventors who share the name “PARK JAE MAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG INNOTEK CO LTD
11 patentsUS9468096B2Oct 11, 2016
Epoxy resin composition, and printed circuit board using same
LG INNOTEK CO LTD2 citations59
US10392499B2Aug 27, 2019
Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
LG INNOTEK CO LTD1 citations56
US11464117B2Oct 4, 2022
Printed circuit board and manufacturing method therefor
LG INNOTEK CO LTD0 citations50
US9902841B2Feb 27, 2018
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
LG INNOTEK CO LTD0 citations49
US9670340B2Jun 6, 2017
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
LG INNOTEK CO LTD0 citations49
US9505914B2Nov 29, 2016
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
LG INNOTEK CO LTD0 citations49
US9462689B2Oct 4, 2016
Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
LG INNOTEK CO LTD0 citations46
US10280289B2May 7, 2019
Epoxy resin composite and printed circuit board comprising insulating layer using the same
LG INNOTEK CO LTD0 citations45
US9000071B2Apr 7, 2015
Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
LG INNOTEK CO LTD0 citations45
US9282637B2Mar 8, 2016
Epoxy resin compound and radiant heat circuit board using the same
LG INNOTEK CO LTD0 citations37
US9445500B2Sep 13, 2016
Epoxy resin composition and printed circuit board using same
LG INNOTEK CO LTD0 citations36
SAMSUNG ELECTRO MECH
8 patentsUS12248239B2Mar 11, 2025
Camera module
SAMSUNG ELECTRO MECH4 citations73
US9245689B2Jan 26, 2016
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US11570345B2Jan 31, 2023
Camera module
SAMSUNG ELECTRO MECH0 citations62
US9202629B2Dec 1, 2015
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations62
US8964354B2Feb 24, 2015
Multi-layered ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations60
US12386194B2Aug 12, 2025
Camera module
SAMSUNG ELECTRO MECH0 citations52
US12395719B2Aug 19, 2025
Camera module
SAMSUNG ELECTRO MECH0 citations51
US9040840B2May 26, 2015
Multilayer ceramic electronic component and mounting board therefor
SAMSUNG ELECTRO MECH0 citations37
HYUNDAI MOTOR CO LTD
7 patentsUS12388090B2Aug 12, 2025
Gas diffusion layer unit for fuel cell and unit cell for fuel cell including same
HYUNDAI MOTOR CO LTD0 citations57
US12176584B2Dec 24, 2024
Gas diffusion layer for fuel cell, method of manufacturing the same, and unit cell for fuel cell including the same
HYUNDAI MOTOR CO LTD0 citations57
US11611085B2Mar 21, 2023
Multiple perforation plate for separator of fuel cell
HYUNDAI MOTOR CO LTD0 citations57
US11276863B2Mar 15, 2022
Gas diffusion layer for fuel cell and method for manufacturing the same
HYUNDAI MOTOR CO LTD1 citations57
US11235688B2Feb 1, 2022
Device for folding emergency exit seat for bus
HYUNDAI MOTOR CO LTD0 citations52
US9657961B2May 23, 2017
Interior lamp for vehicle having air vent
HYUNDAI MOTOR CO LTD1 citations52
US10593957B2Mar 17, 2020
Gas diffusion layer for fuel cells and method of manufacturing the same
HYUNDAI MOTOR CO LTD0 citations50
KIM JONG HAN
2 patentsUS8941973B2Jan 27, 2015
Multilayer ceramic electronic component and method of manufacturing the same
KIM JONG HAN8 citations83
US8867190B2Oct 21, 2014
Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof
KIM JONG HAN5 citations72
KORLOY INC
2 patentsPARK HYUN GYU
2 patentsUS9307675B2Apr 5, 2016
Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
PARK HYUN GYU2 citations60
US9549458B2Jan 17, 2017
Radiant heat circuit board, heat generating device package having the same, and backlight unit
PARK HYUN GYU0 citations50