Inventor
ABBOTT JR JAMES ELMER
US38 patents
⚠️ This page may combine multiple inventors who share the name “ABBOTT JR JAMES ELMER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
28 patentsUS11541568B2Jan 3, 2023
Three-dimensional (3D) printing with a detailing agent fluid and a liquid functional material
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US11260556B2Mar 1, 2022
Additive manufacturing in an atmosphere including oxygen
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11007710B2May 18, 2021
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO4 citations72
US10875240B2Dec 29, 2020
Stabilizing liquid functional material for three- dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO3 citations72
US12202197B2Jan 21, 2025
Lighting for additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO1 citations64
US11701830B2Jul 18, 2023
Extraction of digitally printed build material
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11167478B2Nov 9, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US10946584B2Mar 16, 2021
Particulate build material
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US10913208B2Feb 9, 2021
Extraction of digitally printed build material
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10890486B2Jan 12, 2021
Plasmonic nanostructure including sacrificial passivation coating
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11458679B2Oct 4, 2022
Lighting for additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11633915B2Apr 25, 2023
Removable cassette for 3D printers
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US10882253B2Jan 5, 2021
Removable cassette for 3D printers
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US11279129B2Mar 22, 2022
Amorphous thin metal film
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US11020874B2Jun 1, 2021
Three-dimensional (3D) printing with a sintering aid/fixer fluid and a liquid functional material
HEWLETT PACKARD DEVELOPMENT CO1 citations56
US11104029B2Aug 31, 2021
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10857727B2Dec 8, 2020
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10688716B2Jun 23, 2020
Consolidating a build material for additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10125010B2Nov 13, 2018
Elastic device
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US9352532B2May 31, 2016
Film stack including adhesive layer
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10676806B2Jun 9, 2020
Wear resistant coating
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10532571B2Jan 14, 2020
Printhead structure
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10478994B2Nov 19, 2019
Fabricating a three-dimensional object
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10641727B2May 5, 2020
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US10359392B2Jul 23, 2019
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US9304095B2Apr 5, 2016
Dosimetry via platinum—ruthenium nanoparticle-decorated nanostructure
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US10449763B2Oct 22, 2019
Amorphous thin metal film
HEWLETT PACKARD DEVELOPMENT CO0 citations47
US10680160B2Jun 9, 2020
Piezoelectric thin film stack
HEWLETT PACKARD DEVELOPMENT CO0 citations46
HEWLETT PACKARD DEVELOPMENT CO LP
5 patentsUS9636902B2May 2, 2017
Film stack including adhesive layer
HEWLETT PACKARD DEVELOPMENT CO LP4 citations73
US9469107B2Oct 18, 2016
Thermal inkjet printhead stack with amorphous metal resistor
HEWLETT PACKARD DEVELOPMENT CO LP3 citations71
US9511585B2Dec 6, 2016
Thermal inkjet printhead stack with amorphous thin metal protective layer
HEWLETT PACKARD DEVELOPMENT CO LP3 citations70
US9557288B2Jan 31, 2017
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO LP1 citations60
US9873274B2Jan 23, 2018
Electrocaloric heating and cooling device
HEWLETT PACKARD DEVELOPMENT CO LP0 citations52