Inventor

NAGASAKA TAKASHI

JP40 patents

⚠️ This page may combine multiple inventors who share the name “NAGASAKA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAGASAKA TAKASHI

NIPPON DENSO CO

Electronic device having a plurality of circuit boards arranged therein

Method for producing multi-board electronic device

Container for electronic devices having a plurality of circuit boards

Electronic device having a plurality of circuit boards arranged therein

Hybrid integrated circuit apparatus

Method of producing thick multi-layer substrates

Ceramic multi-layer wiring board

Soldering flux, soldering paste and soldering method using the same

Ceramic multi-layer wiring board

Method of producing a hybrid integrated circuit

Multilayer substrate

Electronic circuit device

Soldering method using soldering flux and soldering paste

Process for manufacturing ceramic multilayer substrate

Ceramic multi-layer wiring substrate and process for preparation thereof

Resistor circuit with reduced temperature coefficient of resistance

Substrate having a multiple metal protected conductive layer and method of manufacturing the same

Thick-film printed substrate including an electrically connecting member and method for fabricating the same

DENSO CORP

Mounting structure of semiconductor element

Wire bonding method

Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same

Multi-layered substrate

Conductive paste composition including conductive metallic powder

Potted hybrid integrated circuit

Method of manufacturing a circuit substrate

Thick film circuit board and method of forming wire bonding electrode thereon

Multilayer circuit board having no local warp on mounting surface thereof

Electronic part mounting method

Mounting structure of electronic parts and mounting method of electronic parts

Semiconductor device including bonded wire based to electronic part and method for manufacturing the same

Electrical device having metal pad bonded with metal wiring and manufacturing method thereof

Method for manufacturing ceramic laminated substrate

TDK CORP

Coil-embedded dust core and method for manufacturing the same

Coil-embedded dust core and method for manufacturing the same

Coil unit

Coil device

Coil device

SUMITOMO METAL CERAMICS INC

Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate

Multilayer ceramic substrate and manufacture thereof

SUMITOMO METAL SMI ELECTRONICS

Process for producing a multilayer ceramic circuit substrate