Inventor
LEWANDOWSKI ERIC P
US21 patents
⚠️ This page may combine multiple inventors who share the name “LEWANDOWSKI ERIC P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS10692831B1Jun 23, 2020
Stud bumps for post-measurement qubit frequency modification
IBM12 citations85
US9586857B2Mar 7, 2017
Controlling fragmentation of chemically strengthened glass
IBM13 citations84
US9472789B2Oct 18, 2016
Thin, flexible microsystem with integrated energy source
IBM9 citations83
US9738560B2Aug 22, 2017
Controlling fragmentation of chemically strengthened glass
IBM2 citations73
US9508566B2Nov 29, 2016
Wafer level overmold for three dimensional surfaces
IBM3 citations73
US10881788B2Jan 5, 2021
Delivery device including reactive material for programmable discrete delivery of a substance
IBM4 citations72
US10096802B2Oct 9, 2018
Homogeneous solid metallic anode for thin film microbattery
IBM1 citations63
US10608158B2Mar 31, 2020
Two-component bump metallization
IBM1 citations62
US11158781B2Oct 26, 2021
Permanent wafer handlers with through silicon vias for thermalization and qubit modification
IBM0 citations61
US9806299B2Oct 31, 2017
Cathode for thin film microbattery
IBM1 citations61
US11766729B2Sep 26, 2023
Molten solder injection head with vacuum filter and differential gauge system
IBM0 citations52
US10629797B2Apr 21, 2020
Two-component bump metallization
IBM0 citations52
US10622590B2Apr 14, 2020
Method of forming a homogeneous solid metallic anode for a thin film microbattery
IBM0 citations52
US9181440B2Nov 10, 2015
Low alpha particle emission electrically-conductive coating
IBM0 citations52
US8815725B2Aug 26, 2014
Low alpha particle emission electrically-conductive coating
IBM1 citations52
US10686164B2Jun 16, 2020
Cathode for thin film microbattery
IBM0 citations51
US10535592B2Jan 14, 2020
Method for forming solder bumps using sacrificial layer
IBM0 citations51
US10069116B2Sep 4, 2018
Cathode for thin film microbattery
IBM0 citations51
US9953908B2Apr 24, 2018
Method for forming solder bumps using sacrificial layer
IBM0 citations51