Inventor
KONDO SEIICHI
JP41 patents
⚠️ This page may combine multiple inventors who share the name “KONDO SEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
21 patentsUS6117775ASep 12, 2000
Polishing method
HITACHI LTD254 citations99
US6562719B2May 13, 2003
Methods of polishing, interconnect-fabrication, and producing semiconductor devices
HITACHI LTD88 citations98
US6326299B1Dec 4, 2001
Method for manufacturing a semiconductor device
HITACHI LTD88 citations98
US6596638B1Jul 22, 2003
Polishing method
HITACHI LTD33 citations96
US6561883B1May 13, 2003
Method of polishing
HITACHI LTD59 citations96
US6376345B1Apr 23, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD46 citations96
US5235449AAug 10, 1993
Polarizer with patterned diacetylene layer, method for producing the same, and liquid crystal display device including such polarizer
HITACHI LTD71 citations96
US6638854B2Oct 28, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD25 citations93
US6509273B1Jan 21, 2003
Method for manufacturing a semiconductor device
HITACHI LTD36 citations93
US6458674B1Oct 1, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD16 citations93
US6565422B1May 20, 2003
Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus
HITACHI LTD29 citations92
US5694059ADec 2, 1997
Buffer of fine connection structure for connecting an atom level circuit and a general semiconductor circuit
HITACHI LTD18 citations92
US5561300AOct 1, 1996
Atomic switching devices and logical circuits
HITACHI LTD29 citations92
US6531400B2Mar 11, 2003
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD12 citations82
US7132367B2Nov 7, 2006
Polishing method
HITACHI LTD4 citations74
US5013526AMay 7, 1991
Superconducting alloys comprising tungsten, molybdenum, silicon and oxygen
HITACHI LTD13 citations74
US7279425B2Oct 9, 2007
Polishing method
HITACHI LTD2 citations63
US6734103B2May 11, 2004
Method of polishing a semiconductor device
HITACHI LTD5 citations63
US6525336B1Feb 25, 2003
Superfine electronic device and method for making same
HITACHI LTD3 citations62
US5510614AApr 23, 1996
Solid surface observation method and apparatus therefor, and electronic apparatus formed of the solid surface observation apparatus and method of forming the electronic apparatus
HITACHI LTD2 citations62
US6849542B2Feb 1, 2005
Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives
HITACHI LTD2 citations59
RENESAS TECH CORP
10 patentsUS6774041B1Aug 10, 2004
Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
RENESAS TECH CORP52 citations96
US7659201B2Feb 9, 2010
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP10 citations93
US6750128B2Jun 15, 2004
Methods of polishing, interconnect-fabrication, and producing semiconductor devices
RENESAS TECH CORP34 citations93
US6899603B2May 31, 2005
Polishing apparatus
RENESAS TECH CORP37 citations92
US6719618B2Apr 13, 2004
Polishing apparatus
RENESAS TECH CORP17 citations92
US7510970B2Mar 31, 2009
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP5 citations74
US6800557B2Oct 5, 2004
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP8 citations74
US7183212B2Feb 27, 2007
Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
RENESAS TECH CORP3 citations63
US7125794B2Oct 24, 2006
Method of manufacturing semiconductor device
RENESAS TECH CORP3 citations60
US7563716B2Jul 21, 2009
Polishing method
RENESAS TECH CORP0 citations52
NGK INSULATORS LTD
2 patentsOHZAKI HIROKI
2 patentsUS10291620B2May 14, 2019
Information processing apparatus, terminal apparatus, program, and information processing system for collaborative use of authentication information between shared services
OHZAKI HIROKI1 citations58
US10243924B2Mar 26, 2019
Service providing system, service providing method, and information processing apparatus
OHZAKI HIROKI0 citations39