Inventor
FRANKENY JEROME A
US14 patents
Patents
14 patentsUS5509200AApr 23, 1996
Method of making laminar stackable circuit board structure
IBM145 citations97
US5313097AMay 17, 1994
High density memory module
IBM184 citations96
US5065227ANov 12, 1991
Integrated circuit packaging using flexible substrate
IBM111 citations96
US6094059AJul 25, 2000
Apparatus and method for burn-in/testing of integrated circuit devices
IBM39 citations95
US6094060AJul 25, 2000
Test head for applying signals in a burn-in test of an integrated circuit
IBM44 citations95
US5949246ASep 7, 1999
Test head for applying signals in a burn-in test of an integrated circuit
IBM65 citations95
US5161087ANov 3, 1992
Pivotal heat sink assembly
IBM79 citations95
US5037311AAug 6, 1991
High density interconnect strip
IBM61 citations95
US5363275ANov 8, 1994
Modular component computer system
IBM33 citations92
US5290710AMar 1, 1994
Method for testing integrated circuits on a carrier substrate
IBM32 citations92
US5279711AJan 18, 1994
Chip attach and sealing method
IBM38 citations92
US5148003ASep 15, 1992
Modular test oven
IBM15 citations82
US5140879AAug 25, 1992
Variable array punch
IBM13 citations73
US5222012AJun 22, 1993
Power management circuit for a magnetic repulsion punch
IBM9 citations71