Inventor
IMKEN RONALD L
US13 patents
⚠️ This page may combine multiple inventors who share the name “IMKEN RONALD L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS5229916AJul 20, 1993
Chip edge interconnect overlay element
IBM162 citations98
US5509200AApr 23, 1996
Method of making laminar stackable circuit board structure
IBM145 citations97
US5316787AMay 31, 1994
Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate
IBM65 citations96
US5065227ANov 12, 1991
Integrated circuit packaging using flexible substrate
IBM111 citations96
US5198693AMar 30, 1993
Aperture formation in aluminum circuit card for enhanced thermal dissipation
IBM63 citations95
US5037311AAug 6, 1991
High density interconnect strip
IBM61 citations95
US5363275ANov 8, 1994
Modular component computer system
IBM33 citations92
US5146674ASep 15, 1992
Manufacturing process of a high density substrate design
IBM40 citations92
US4943242AJul 24, 1990
Zero insertion force high density connector system
IBM9 citations72
3M INNOVATIVE PROPERTIES CO
3 patentsUS6489042B2Dec 3, 2002
Photoimageable dielectric material for circuit protection
3M INNOVATIVE PROPERTIES CO33 citations92
US7871150B2Jan 18, 2011
Flexible circuits having ink-resistant covercoats
3M INNOVATIVE PROPERTIES CO3 citations60
US7947429B2May 24, 2011
Long length flexible circuits and method of making same
3M INNOVATIVE PROPERTIES CO0 citations51