P

Inventor

YANG SIMON SHI-NING

CN22 patents
⚠️ This page may combine multiple inventors who share the name “YANG SIMON SHI-NING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANGTZE MEMORY TECH CO LTD

20 patents
US10283452B2May 7, 2019

Three-dimensional memory devices having a plurality of NAND strings

YANGTZE MEMORY TECH CO LTD61 citations98
US10147732B1Dec 4, 2018

Source structure of three-dimensional memory device and method for forming the same

YANGTZE MEMORY TECH CO LTD66 citations98
US10593690B2Mar 17, 2020

Hybrid bonding contact structure of three-dimensional memory device

YANGTZE MEMORY TECH CO LTD21 citations94
US11211397B2Dec 28, 2021

Three-dimensional memory devices and methods for forming the same

YANGTZE MEMORY TECH CO LTD6 citations84
US11031333B2Jun 8, 2021

Three-dimensional memory devices having a plurality of NAND strings

YANGTZE MEMORY TECH CO LTD8 citations84
US10923491B2Feb 16, 2021

Hybrid bonding contact structure of three-dimensional memory device

YANGTZE MEMORY TECH CO LTD4 citations84
US10679721B2Jun 9, 2020

Structure and method for testing three-dimensional memory device

YANGTZE MEMORY TECH CO LTD9 citations83
US12170258B2Dec 17, 2024

Memory devices having vertical transistors and methods for forming the same

YANGTZE MEMORY TECH CO LTD3 citations74
US11758732B2Sep 12, 2023

Hybrid bonding contact structure of three-dimensional memory device

YANGTZE MEMORY TECH CO LTD3 citations73
US11527547B2Dec 13, 2022

Hybrid bonding contact structure of three-dimensional memory device

YANGTZE MEMORY TECH CO LTD3 citations73
US10804279B2Oct 13, 2020

Source structure of three-dimensional memory device and method for forming the same

YANGTZE MEMORY TECH CO LTD4 citations73
US10998079B2May 4, 2021

Structure and method for testing three-dimensional memory device

YANGTZE MEMORY TECH CO LTD2 citations72
US12142575B2Nov 12, 2024

Staircase etch control in forming three-dimensional memory device

YANGTZE MEMORY TECH CO LTD0 citations62
US12137568B2Nov 5, 2024

Hybrid bonding contact structure of three-dimensional memory device

YANGTZE MEMORY TECH CO LTD0 citations62
US11805646B2Oct 31, 2023

Three-dimensional memory devices and methods for forming the same

YANGTZE MEMORY TECH CO LTD0 citations62
US11699657B2Jul 11, 2023

Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer

YANGTZE MEMORY TECH CO LTD0 citations62
US11462474B2Oct 4, 2022

Three-dimensional memory devices having a plurality of NAND strings

YANGTZE MEMORY TECH CO LTD0 citations62
US11264397B2Mar 1, 2022

Source structure of three-dimensional memory device and method for forming the same

YANGTZE MEMORY TECH CO LTD0 citations62
US10522474B2Dec 31, 2019

Staircase etch control in forming three-dimensional memory device

YANGTZE MEMORY TECH CO LTD1 citations62
US10423176B2Sep 24, 2019

Low-dropout regulators

YANGTZE MEMORY TECH CO LTD1 citations62

CHARTERED SEMICONDUCTOR MFG

2 patents