Inventor
YANG SIMON SHI-NING
CN22 patents
⚠️ This page may combine multiple inventors who share the name “YANG SIMON SHI-NING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YANGTZE MEMORY TECH CO LTD
20 patentsUS10283452B2May 7, 2019
Three-dimensional memory devices having a plurality of NAND strings
YANGTZE MEMORY TECH CO LTD61 citations98
US10147732B1Dec 4, 2018
Source structure of three-dimensional memory device and method for forming the same
YANGTZE MEMORY TECH CO LTD66 citations98
US10593690B2Mar 17, 2020
Hybrid bonding contact structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD21 citations94
US11211397B2Dec 28, 2021
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD6 citations84
US11031333B2Jun 8, 2021
Three-dimensional memory devices having a plurality of NAND strings
YANGTZE MEMORY TECH CO LTD8 citations84
US10923491B2Feb 16, 2021
Hybrid bonding contact structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD4 citations84
US10679721B2Jun 9, 2020
Structure and method for testing three-dimensional memory device
YANGTZE MEMORY TECH CO LTD9 citations83
US12170258B2Dec 17, 2024
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD3 citations74
US11758732B2Sep 12, 2023
Hybrid bonding contact structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD3 citations73
US11527547B2Dec 13, 2022
Hybrid bonding contact structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD3 citations73
US10804279B2Oct 13, 2020
Source structure of three-dimensional memory device and method for forming the same
YANGTZE MEMORY TECH CO LTD4 citations73
US10998079B2May 4, 2021
Structure and method for testing three-dimensional memory device
YANGTZE MEMORY TECH CO LTD2 citations72
US12142575B2Nov 12, 2024
Staircase etch control in forming three-dimensional memory device
YANGTZE MEMORY TECH CO LTD0 citations62
US12137568B2Nov 5, 2024
Hybrid bonding contact structure of three-dimensional memory device
YANGTZE MEMORY TECH CO LTD0 citations62
US11805646B2Oct 31, 2023
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations62
US11699657B2Jul 11, 2023
Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer
YANGTZE MEMORY TECH CO LTD0 citations62
US11462474B2Oct 4, 2022
Three-dimensional memory devices having a plurality of NAND strings
YANGTZE MEMORY TECH CO LTD0 citations62
US11264397B2Mar 1, 2022
Source structure of three-dimensional memory device and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations62
US10522474B2Dec 31, 2019
Staircase etch control in forming three-dimensional memory device
YANGTZE MEMORY TECH CO LTD1 citations62
US10423176B2Sep 24, 2019
Low-dropout regulators
YANGTZE MEMORY TECH CO LTD1 citations62