Inventor

YEAN CHIOU JUN

TW2 patents

Patents

2 patents

US11024552B2Jun 1, 2021

Device arrangement structure assembly having adhesive tape layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58

US10535572B2Jan 14, 2020

Device arrangement structure assembly and test method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations58