Inventor
LI CHENG-YUAN
TW13 patents
Patents
13 patentsUS10692826B2Jun 23, 2020
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10276616B2Apr 30, 2019
Image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9559135B2Jan 31, 2017
Conduction layer for stacked CIS charging prevention
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12218051B2Feb 4, 2025
Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068246B2Aug 20, 2024
Redistribution layer layouts on integrated circuits and methods for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12021054B2Jun 25, 2024
Redistribution layer (RDL) layouts for integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11791299B2Oct 17, 2023
Redistribution layer (RDL) layouts for integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11456263B2Sep 27, 2022
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12199036B2Jan 14, 2025
Low resistance interconnect structure for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11476191B2Oct 18, 2022
Low resistance interconnect structure for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12009323B2Jun 11, 2024
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11817472B2Nov 14, 2023
Anchor structures and methods for uniform wafer planarization and bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11152417B2Oct 19, 2021
Anchor structures and methods for uniform wafer planarization and bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52