Inventor

PASCH NICHOLAS F

US143 patents

⚠️ This page may combine multiple inventors who share the name “PASCH NICHOLAS F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PASCH NICHOLAS F

LSI LOGIC CORP

Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing

Semiconductor device assembly techniques using preformed planar structures

Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate

Flexible preformed planar structures for interposing between a chip and a substrate

Shaped, self-aligning micro-bump structures

Low dielectric constant insulation layer for integrated circuit structure and method of making same

Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias

Die-attach technique for flip-chip style mounting of semiconductor dies

Methods of cleaning semiconductor substrates after polishing

Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices

Process for forming low dielectric constant layers using fullerenes

Automating photolithography in the fabrication of integrated circuits

Method and apparatus for application of proximity correction with unitary segmentation

System and method for performing optical proximity correction on the interface between optical proximity corrected cells

Fabricating a semiconductor device using precursor CMOS semiconductor substrate of a given configuration

Low dielectric constant insulation layer for integrated circuit structure and method of making same

Systems having advanced pre-formed planar structures

Use of silicon for integrated circuit device interconnection by direct writing of patterns therein

Process for mounting a semiconductor device to a circuit substrate

Method of doping metal layers for electromigration resistance

Process for manufacturing off-axis power branches for interior bond pad arrangements

Shaped, self-aligning micro-bump structures

Techniques for assembling polishing pads for chemical-mechanical polishing of silicon wafers

Techniques for via formation and filling

Trench planarization techniques

Fabrication of substrates for multi-chip modules

Fluid-filled and gas-filled semiconductor packages

Techniques for assembling polishing pads for silicon wafer polishing

Off-axis power branches for interior bond pad arrangements

Preformed planar structures employing embedded conductors

Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers

Trench planarization techniques

Trench planarization techniques

Method and apparatus for isolation of flux materials in flip-chip manufacturing

Apparatus for isolation of flux materials in &#34;flip-chip&#34; manufacturing

Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing

Use of corrosion inhibiting compounds in post-etch cleaning processes of an integrated circuit

Circuit device interconnection by direct writing of patterns therein

Method of fabricating a linearly continuous integrated circuit gate array

System having input-output drive reduction

Apparatus and method using optical energy for specifying and quantitatively controlling chemically-reactive components of semiconductor processing plasma etching gas

Method of forming a semiconductor device having CMOS structures on a semiconductor substrate

Low dielectric constant insulation layer for integrated circuit structure and method of making same

Preformed planar structures for semiconductor device assemblies

Method for mounting integrated circuit chips on a mini-board

Process for forming low dielectric constant insulation layer on integrated circuit structure

LSI LOGIC INC

Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers

LSI LOGIC

Optically transmissive preformed planar structures

LSI LOGIC CORPORTION

Techniques for via formation and filling

ELWHA LLC

Error correction with non-volatile memory on an integrated circuit

Apparatus for isolation of flux materials in "flip-chip" manufacturing