P

Inventor

HU SHENG

CN28 patents
⚠️ This page may combine multiple inventors who share the name “HU SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WUHAN XINXIN SEMICONDUCTOR MFG

15 patents
US11791367B2Oct 17, 2023

Semiconductor device and method of fabricating the same

WUHAN XINXIN SEMICONDUCTOR MFG2 citations73
US11114414B2Sep 7, 2021

Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnection

WUHAN XINXIN SEMICONDUCTOR MFG2 citations73
US10943853B2Mar 9, 2021

Semiconductor device and manufacturing method thereof

WUHAN XINXIN SEMICONDUCTOR MFG4 citations72
US11107856B2Aug 31, 2021

Manufacturing method of image sensing device

WUHAN XINXIN SEMICONDUCTOR MFG0 citations61
US11804458B2Oct 31, 2023

Method of fabricating integrated circuit device

WUHAN XINXIN SEMICONDUCTOR MFG1 citations60
US12328963B2Jun 10, 2025

Semiconductor device and manufacturing method therefor

WUHAN XINXIN SEMICONDUCTOR MFG0 citations52
US12094704B2Sep 17, 2024

Semiconductor device and method of fabricating the same

WUHAN XINXIN SEMICONDUCTOR MFG0 citations52
US11114401B2Sep 7, 2021

Bonding structure and method for manufacturing the same

WUHAN XINXIN SEMICONDUCTOR MFG0 citations51
US11043448B2Jun 22, 2021

Semiconductor device with vertically separated openings and manufacturing method thereof

WUHAN XINXIN SEMICONDUCTOR MFG0 citations51
US10756061B2Aug 25, 2020

Multi-layer chip and fabrication method thereof

WUHAN XINXIN SEMICONDUCTOR MFG0 citations51
US12463165B2Nov 4, 2025

Bonding structure and manufacturing method therefor

WUHAN XINXIN SEMICONDUCTOR MFG0 citations50
US10840085B2Nov 17, 2020

Method for improving bonding of dangling bonds of silicon atoms

WUHAN XINXIN SEMICONDUCTOR MFG0 citations49
US12322707B2Jun 3, 2025

Large die wafer, large die and method of forming the same

WUHAN XINXIN SEMICONDUCTOR MFG0 citations48
US11264242B2Mar 1, 2022

Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device

WUHAN XINXIN SEMICONDUCTOR MFG0 citations46
US11024534B2Jun 1, 2021

Semiconductor device having opening and via hole and method for manufacturing the same

WUHAN XINXIN SEMICONDUCTOR MFG0 citations41

ZHEJIANG YPOO HEALTH TECH CO LTD

4 patents

Mukherjee Dibyendu

3 patents

CHENGDU BOE OPTOELECT TECH CO

2 patents

PETROCHINA CO LTD

2 patents

ZHEJIANG UNIV OF SCIENCE & TECHNOLOGY

1 patent

IBM

1 patent