Inventor

YEH SU-YU

TW29 patents

⚠️ This page may combine multiple inventors who share the name “YEH SU-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH SU-YU

TAIWAN SEMICONDUCTOR MFG CO LTD

BSI chip with backside alignment mark

Method for forming a semiconductor device

Polysilicon removal in word line contact region of memory devices

Method for bonding wafers and bonding tool

Image sensor grid and method of fabrication of same

Chemical replacement system

Memory device and manufacturing method thereof

Memory device and manufacturing method thereof

Memory device and manufacturing method thereof

BSI chip with backside alignment mark

Polysilicon removal in word line contact region of memory devices

Polysilicon removal in word line contact region of memory devices

Manufacturing method of semiconductor device and semiconductor processing system

Manufacturing method of semiconductor device and semiconductor processing system

Manufacturing method of semiconductor device and semiconductor processing system

Method for monitoring gas in wafer processing system

Photoresist bottle container

System and method for cleaning a pre-clean process chamber

Image sensor with pad structure

Lens structure

Wafer treatment system and method of treating wafer

TAIWAN SEMICONDUCTOR MFG

Method for forming lining oxide in shallow trench isolation incorporating pre-annealing step

Dual-stage wet oxidation process utilizing varying H2/O2 ratios

Wafer chuck for producing an inert gas blanket and method for using

Image sensor grid and method of manufacturing same

Image sensor grid and method of manufacturing same

Method of high selectivity wet etching of salicides

Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum pad

Method reducing the effects of N2 gas contamination in an ion implanter