Inventor
PANCZAK ANTHONY E
US10 patents
⚠️ This page may combine multiple inventors who share the name “PANCZAK ANTHONY E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
8 patentsUS6268654B1Jul 31, 2001
Integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC198 citations99
US6228676B1May 8, 2001
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC151 citations99
US6117705ASep 12, 2000
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC202 citations99
US5981314ANov 9, 1999
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC280 citations99
US6962829B2Nov 8, 2005
Method of making near chip size integrated circuit package
AMKOR TECHNOLOGY INC148 citations98
US6034429AMar 7, 2000
Integrated circuit package
AMKOR TECHNOLOGY INC55 citations96
US5950074ASep 7, 1999
Method of making an integrated circuit package
AMKOR TECHNOLOGY INC75 citations96
US5796163AAug 18, 1998
Solder ball joint
AMKOR TECHNOLOGY INC53 citations96