Inventor
JEWRAM RADESH
US10 patents
⚠️ This page may combine multiple inventors who share the name “JEWRAM RADESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BERGQUIST CO
4 patentsUS6657297B1Dec 2, 2003
Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
BERGQUIST CO89 citations92
US6984685B2Jan 10, 2006
Thermal interface pad utilizing low melting metal with retention matrix
BERGQUIST CO26 citations91
US6399209B1Jun 4, 2002
Integrated release films for phase-change interfaces
BERGQUIST CO42 citations89
US7760507B2Jul 20, 2010
Thermally and electrically conductive interconnect structures
BERGQUIST CO15 citations83
JEWRAM RADESH
4 patentsUS8076773B2Dec 13, 2011
Thermal interface with non-tacky surface
JEWRAM RADESH19 citations91
US8110919B2Feb 7, 2012
Thermal interface with non-tacky surface
JEWRAM RADESH15 citations82
US8430264B2Apr 30, 2013
Method for packaging thermal interface materials
JEWRAM RADESH8 citations78
US8205766B2Jun 26, 2012
Method for packaging thermal interface materials
JEWRAM RADESH3 citations59