Inventor
KANAZAWA JITSUO
JP18 patents
⚠️ This page may combine multiple inventors who share the name “KANAZAWA JITSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
17 patentsUS6204454B1Mar 20, 2001
Wiring board and process for the production thereof
TDK CORP115 citations97
US6181015B1Jan 30, 2001
Face-down mounted surface acoustic wave device
TDK CORP115 citations97
US6417026B2Jul 9, 2002
Acoustic wave device face-down mounted on a substrate
TDK CORP73 citations96
US6460591B1Oct 8, 2002
Ultrasonic bonding method and ultrasonic bonding apparatus
TDK CORP27 citations92
US6282781B1Sep 4, 2001
Resin package fabrication process
TDK CORP42 citations92
US7505239B2Mar 17, 2009
Light emitting device
TDK CORP29 citations90
US6281436B1Aug 28, 2001
Encapsulated surface mounting electronic part
TDK CORP18 citations84
US6730858B2May 4, 2004
Circuit board having bonding areas to be joined with bumps by ultrasonic bonding
TDK CORP14 citations83
US7671468B2Mar 2, 2010
Light emitting apparatus
TDK CORP11 citations81
US6565687B2May 20, 2003
Ultrasonic bonding method
TDK CORP6 citations74
US6471783B1Oct 29, 2002
Production method of electronic parts and water treatment apparatus
TDK CORP8 citations73
US6320739B1Nov 20, 2001
Electronic part and manufacturing method therefor
TDK CORP9 citations73
US6263565B1Jul 24, 2001
Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same
TDK CORP10 citations73
US6382495B2May 7, 2002
Chip junction nozzle
TDK CORP5 citations71
US6189760B1Feb 20, 2001
Chip junction nozzle
TDK CORP8 citations71
US7355251B2Apr 8, 2008
Light emitting device
TDK CORP5 citations62
US6749183B2Jun 15, 2004
Production method of electronic parts and water treatment apparatus
TDK CORP1 citations51