Inventor
YAMAMOTO SYUICHIRO
JP7 patents
Patents
7 patentsUS6204454B1Mar 20, 2001
Wiring board and process for the production thereof
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US6282781B1Sep 4, 2001
Resin package fabrication process
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US6730858B2May 4, 2004
Circuit board having bonding areas to be joined with bumps by ultrasonic bonding
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US6471783B1Oct 29, 2002
Production method of electronic parts and water treatment apparatus
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US6320739B1Nov 20, 2001
Electronic part and manufacturing method therefor
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US6263565B1Jul 24, 2001
Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same
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US6749183B2Jun 15, 2004
Production method of electronic parts and water treatment apparatus
TDK CORP1 citations51