P

Inventor

CHANG CHIH-YUAN

TW56 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIH-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

22 patents
US9831148B2Nov 28, 2017

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD104 citations99
US10163852B2Dec 25, 2018

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92
US10763164B2Sep 1, 2020

Package structure with inductor and method of forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10497668B2Dec 3, 2019

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9893042B2Feb 13, 2018

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11302649B2Apr 12, 2022

Semiconductor device with shielding structure for cross-talk reduction

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations74
US11195817B2Dec 7, 2021

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11063016B2Jul 13, 2021

Integrated fan-out package including voltage regulators and methods forming same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10665560B2May 26, 2020

Optical semiconductor package and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10269728B2Apr 23, 2019

Semiconductor device with shielding structure for cross-talk reduction

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12074122B2Aug 27, 2024

Inductor structure, semiconductor package and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12040281B2Jul 16, 2024

Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11658134B2May 23, 2023

Inductor structure, semiconductor package and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11094634B2Aug 17, 2021

Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11830841B2Nov 28, 2023

Semiconductor package and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11562926B2Jan 24, 2023

Package structure and method of forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11322470B2May 3, 2022

Optical semiconductor package and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11075136B2Jul 27, 2021

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10692817B2Jun 23, 2020

Semiconductor device with shielding structure for cross-talk reduction

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10559517B2Feb 11, 2020

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163751B2Dec 25, 2018

Heat transfer structures and methods for IC packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9530705B2Dec 27, 2016

4 port L-2L de-embedding method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52

NOVATEK MICROELECTRONICS CORP

10 patents

ALILIFE IND CO LTD

3 patents

HUANG HE-WEI

3 patents

AVAYA TECHNOLOGY CORP

2 patents

ACER INC

2 patents

MICRON TECHNOLOGY INC

2 patents

AVAGO TECH INT SALES PTE LID

2 patents

CHICONY POWER TECH CO LTD

1 patent

TAIWAN SEMICONDUCTOR MFG

1 patent

CHANG HUI-HUNG

1 patent

FULLTECH FIBER GLASS CORP

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.