Inventor
CHUNG JAE SIK
KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG JAE SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7276799B2Oct 2, 2007
Chip stack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD429 citations99
US7537959B2May 26, 2009
Chip stack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD52 citations98
US8368231B2Feb 5, 2013
Chipstack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD12 citations92
US7977156B2Jul 12, 2011
Chipstack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD11 citations84
US7307340B2Dec 11, 2007
Wafer-level electronic modules with integral connector contacts
SAMSUNG ELECTRONICS CO LTD11 citations84
US7205660B2Apr 17, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7855144B2Dec 21, 2010
Method of forming metal lines and bumps for semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations73
US7312143B2Dec 25, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
LG CHEMICAL LTD
4 patentsUS7985501B2Jul 26, 2011
Integral cap assembly having protective circuit module, and secondary battery comprising the same
LG CHEMICAL LTD14 citations90
US6692874B2Feb 17, 2004
Electrolytes and lithium ion battery using the same
LG CHEMICAL LTD11 citations68
US7828859B2Nov 9, 2010
Method for manufacturing a battery having a battery after service label, and a battery manufactured by the method
LG CHEMICAL LTD2 citations62
US7648797B2Jan 19, 2010
Unification type cap assembly containing protection circuit board and secondary battery comprising the same
LG CHEMICAL LTD0 citations50