Inventor
SHANNON STEVEN C
US38 patents
⚠️ This page may combine multiple inventors who share the name “SHANNON STEVEN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
28 patentsUS7967944B2Jun 28, 2011
Method of plasma load impedance tuning by modulation of an unmatched low power RF generator
APPLIED MATERIALS INC57 citations98
US8018164B2Sep 13, 2011
Plasma reactor with high speed plasma load impedance tuning by modulation of different unmatched frequency sources
APPLIED MATERIALS INC47 citations94
US7968469B2Jun 28, 2011
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity
APPLIED MATERIALS INC46 citations94
US8357264B2Jan 22, 2013
Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of a source power or bias power RF generator
APPLIED MATERIALS INC33 citations93
US7780866B2Aug 24, 2010
Method of plasma confinement for enhancing magnetic control of plasma radial distribution
APPLIED MATERIALS INC40 citations92
US7359177B2Apr 15, 2008
Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output
APPLIED MATERIALS INC42 citations92
US7326872B2Feb 5, 2008
Multi-frequency dynamic dummy load and method for testing plasma reactor multi-frequency impedance match networks
APPLIED MATERIALS INC19 citations92
US7620511B2Nov 17, 2009
Method for determining plasma characteristics
APPLIED MATERIALS INC14 citations91
US6652712B2Nov 25, 2003
Inductive antenna for a plasma reactor producing reduced fluorine dissociation
APPLIED MATERIALS INC29 citations91
US7431857B2Oct 7, 2008
Plasma generation and control using a dual frequency RF source
APPLIED MATERIALS INC26 citations90
US8002945B2Aug 23, 2011
Method of plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power RF generator
APPLIED MATERIALS INC17 citations84
US7988815B2Aug 2, 2011
Plasma reactor with reduced electrical skew using electrical bypass elements
APPLIED MATERIALS INC11 citations84
US7972467B2Jul 5, 2011
Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
APPLIED MATERIALS INC10 citations84
US7879185B2Feb 1, 2011
Dual frequency RF match
APPLIED MATERIALS INC7 citations84
US7879731B2Feb 1, 2011
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
APPLIED MATERIALS INC13 citations84
US7813103B2Oct 12, 2010
Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes
APPLIED MATERIALS INC14 citations84
US7812278B2Oct 12, 2010
Method for testing plasma reactor multi-frequency impedance match networks
APPLIED MATERIALS INC13 citations84
US7777599B2Aug 17, 2010
Methods and apparatus for controlling characteristics of a plasma
APPLIED MATERIALS INC12 citations84
US7754997B2Jul 13, 2010
Apparatus and method to confine plasma and reduce flow resistance in a plasma
APPLIED MATERIALS INC8 citations84
US7585384B2Sep 8, 2009
Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
APPLIED MATERIALS INC10 citations84
US7510665B2Mar 31, 2009
Plasma generation and control using dual frequency RF signals
APPLIED MATERIALS INC17 citations84
US7848898B2Dec 7, 2010
Method for monitoring process drift using plasma characteristics
APPLIED MATERIALS INC11 citations83
US7838430B2Nov 23, 2010
Plasma control using dual cathode frequency mixing
APPLIED MATERIALS INC8 citations83
US7994872B2Aug 9, 2011
Apparatus for multiple frequency power application
APPLIED MATERIALS INC6 citations74
US7286948B1Oct 23, 2007
Method for determining plasma characteristics
APPLIED MATERIALS INC9 citations72
US7884025B2Feb 8, 2011
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources
APPLIED MATERIALS INC4 citations63
US7375947B2May 20, 2008
Method of feedback control of ESC voltage using wafer voltage measurement at the bias supply output
APPLIED MATERIALS INC3 citations63
US7440859B2Oct 21, 2008
Method for determining plasma characteristics
APPLIED MATERIALS INC2 citations61
SHANNON STEVEN C
4 patentsUS8092605B2Jan 10, 2012
Magnetic confinement of a plasma
SHANNON STEVEN C37 citations90
US8337661B2Dec 25, 2012
Plasma reactor with plasma load impedance tuning for engineered transients by synchronized modulation of an unmatched low power RF generator
SHANNON STEVEN C12 citations83
US8324525B2Dec 4, 2012
Method of plasma load impedance tuning for engineered transients by synchronized modulation of a source power or bias power RF generator
SHANNON STEVEN C12 citations83
US8237517B2Aug 7, 2012
Apparatus for multiple frequency power application
SHANNON STEVEN C3 citations62
COLLINS KENNETH S
2 patentsUS8076247B2Dec 13, 2011
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
COLLINS KENNETH S11 citations83
US8080479B2Dec 20, 2011
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
COLLINS KENNETH S6 citations73