Inventor
CHIN CHEE KEONG
CN17 patents
⚠️ This page may combine multiple inventors who share the name “CHIN CHEE KEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIN CHEE KEONG
6 patentsUS8138017B2Mar 20, 2012
Integrated circuit package system with through semiconductor vias and method of manufacture thereof
CHIN CHEE KEONG24 citations91
US8541886B2Sep 24, 2013
Integrated circuit packaging system with via and method of manufacture thereof
CHIN CHEE KEONG8 citations82
US8242607B2Aug 14, 2012
Integrated circuit package system with offset stacked die and method of manufacture thereof
CHIN CHEE KEONG7 citations82
US8946878B2Feb 3, 2015
Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor
CHIN CHEE KEONG4 citations66
US8901439B2Dec 2, 2014
Integrated circuit package system with window opening
CHIN CHEE KEONG0 citations46
US8288860B2Oct 16, 2012
Memory device system with stacked packages
CHIN CHEE KEONG0 citations41
SANDISK SEMICONDUCTOR SHANGHAI CO LTD
4 patentsUS10418334B2Sep 17, 2019
Semiconductor device including corner recess
SANDISK SEMICONDUCTOR SHANGHAI CO LTD2 citations71
US10483239B2Nov 19, 2019
Semiconductor device including dual pad wire bond interconnection
SANDISK SEMICONDUCTOR SHANGHAI CO LTD5 citations64
US10128218B2Nov 13, 2018
Semiconductor device including die bond pads at a die edge
SANDISK SEMICONDUCTOR SHANGHAI CO LTD0 citations47
US10283485B2May 7, 2019
Semiconductor device including conductive bump interconnections
SANDISK SEMICONDUCTOR SHANGHAI CO LTD0 citations45