Inventor
FENG YU FENG
CN3 patents
Patents
3 patentsUS8946878B2Feb 3, 2015
Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor
CHIN CHEE KEONG4 citations66
US8901439B2Dec 2, 2014
Integrated circuit package system with window opening
CHIN CHEE KEONG0 citations46
US8288860B2Oct 16, 2012
Memory device system with stacked packages
CHIN CHEE KEONG0 citations41