P

Inventor

BANG JEONG HO

KR42 patents
⚠️ This page may combine multiple inventors who share the name “BANG JEONG HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

37 patents
US6121118ASep 19, 2000

Chip separation device and method

SAMSUNG ELECTRONICS CO LTD149 citations98
US6489790B1Dec 3, 2002

Socket including pressure conductive rubber and mesh for testing of ball grid array package

SAMSUNG ELECTRONICS CO LTD39 citations92
US5870086AFeb 9, 1999

Power saving display device and method for controlling power thereof

SAMSUNG ELECTRONICS CO LTD26 citations92
US5621625AApr 15, 1997

Surge protection circuit for a switching mode power supply

SAMSUNG ELECTRONICS CO LTD40 citations92
US6903567B2Jun 7, 2005

Test apparatus having multiple test sites at one handler and its test method

SAMSUNG ELECTRONICS CO LTD17 citations91
US7084655B2Aug 1, 2006

Burn-in test apparatus for BGA packages using forced heat exhaust

SAMSUNG ELECTRONICS CO LTD15 citations82
US6960908B2Nov 1, 2005

Method for electrical testing of semiconductor package that detects socket defects in real time

SAMSUNG ELECTRONICS CO LTD14 citations82
US6462534B2Oct 8, 2002

Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith

SAMSUNG ELECTRONICS CO LTD20 citations81
US7438563B2Oct 21, 2008

Connector for testing a semiconductor package

SAMSUNG ELECTRONICS CO LTD9 citations80
US7227351B2Jun 5, 2007

Apparatus and method for performing parallel test on integrated circuit devices

SAMSUNG ELECTRONICS CO LTD11 citations80
US8018899B2Sep 13, 2011

Handoff system and method between different kinds of devices, SIP server and operational method of SIP server

SAMSUNG ELECTRONICS CO LTD7 citations79
US6337695B1Jan 8, 2002

Circuit for controlling a contrast level and compensating a brightness level of a video display apparatus and method therefor

SAMSUNG ELECTRONICS CO LTD7 citations74
US6183589B1Feb 6, 2001

Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads

SAMSUNG ELECTRONICS CO LTD7 citations73
US6861682B2Mar 1, 2005

Laser link structure capable of preventing an upper crack and broadening an energy window of a laser beam, and fuse box using the same

SAMSUNG ELECTRONICS CO LTD7 citations72
US6850450B2Feb 1, 2005

Fuse box including make-link and redundant address decoder having the same, and method for repairing defective memory cell

SAMSUNG ELECTRONICS CO LTD10 citations72
US6201746B1Mar 13, 2001

Test method for high speed memory devices in which limit conditions for the clock are defined

SAMSUNG ELECTRONICS CO LTD9 citations71
US7254757B2Aug 7, 2007

Flash memory test system and method capable of test time reduction

SAMSUNG ELECTRONICS CO LTD7 citations70
US6943577B2Sep 13, 2005

Multichip package test

SAMSUNG ELECTRONICS CO LTD6 citations70
US6842031B2Jan 11, 2005

Method of electrically testing semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations66
US6710550B2Mar 23, 2004

Plasma display panel apparatus and method of protecting an over current thereof

SAMSUNG ELECTRONICS CO LTD5 citations63
US6686929B2Feb 3, 2004

Broadband switching drive compensating circuit for a video display device

SAMSUNG ELECTRONICS CO LTD4 citations63
US5942861AAug 24, 1999

Front/back porch voltage-regulator of vertical focus control signal

SAMSUNG ELECTRONICS CO LTD4 citations63
US5780978AJul 14, 1998

Vertical focusing circuit

SAMSUNG ELECTRONICS CO LTD5 citations63
US6507801B1Jan 14, 2003

Semiconductor device testing system

SAMSUNG ELECTRONICS CO LTD6 citations62
US7602172B2Oct 13, 2009

Test apparatus having multiple head boards at one handler and its test method

SAMSUNG ELECTRONICS CO LTD1 citations61
US7378864B2May 27, 2008

Test apparatus having multiple test sites at one handler and its test method

SAMSUNG ELECTRONICS CO LTD4 citations61
US7017428B2Mar 28, 2006

Test kit for semiconductor package and method for testing semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD5 citations61
US7230417B2Jun 12, 2007

Test system of semiconductor device having a handler remote control and method of operating the same

SAMSUNG ELECTRONICS CO LTD5 citations60
US6841425B2Jan 11, 2005

Wafer treatment method for protecting fuse box of semiconductor chip

SAMSUNG ELECTRONICS CO LTD3 citations60
US7327154B2Feb 5, 2008

Multichip package test

SAMSUNG ELECTRONICS CO LTD3 citations59
US5940413AAug 17, 1999

Method for detecting operational errors in a tester for semiconductor devices

SAMSUNG ELECTRONICS CO LTD4 citations58
US7492032B2Feb 17, 2009

Fuse regions of a semiconductor memory device and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations56
US6700337B2Mar 2, 2004

Apparatus for generating dynamic focus signal

SAMSUNG ELECTRONICS CO LTD0 citations52
US7408339B2Aug 5, 2008

Test system of semiconductor device having a handler remote control and method of operating the same

SAMSUNG ELECTRONICS CO LTD1 citations50
US6922050B2Jul 26, 2005

Method for testing a remnant batch of semiconductor devices

SAMSUNG ELECTRONICS CO LTD1 citations50
US9426890B2Aug 23, 2016

Display apparatus

SAMSUNG ELECTRONICS CO LTD1 citations47
US6005357ADec 21, 1999

Vertical oscillation circuit for display device

SAMSUNG ELECTRONICS CO LTD0 citations42

HYNIX SEMICONDUCTOR INC

2 patents

INTEGRATED SILICON SOLUTION INC

2 patents

HYUNDAI ELECTRONICS IND

1 patent