Inventor
BANG JEONG HO
KR42 patents
⚠️ This page may combine multiple inventors who share the name “BANG JEONG HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
37 patentsUS6121118ASep 19, 2000
Chip separation device and method
SAMSUNG ELECTRONICS CO LTD149 citations98
US6489790B1Dec 3, 2002
Socket including pressure conductive rubber and mesh for testing of ball grid array package
SAMSUNG ELECTRONICS CO LTD39 citations92
US5870086AFeb 9, 1999
Power saving display device and method for controlling power thereof
SAMSUNG ELECTRONICS CO LTD26 citations92
US5621625AApr 15, 1997
Surge protection circuit for a switching mode power supply
SAMSUNG ELECTRONICS CO LTD40 citations92
US6903567B2Jun 7, 2005
Test apparatus having multiple test sites at one handler and its test method
SAMSUNG ELECTRONICS CO LTD17 citations91
US7084655B2Aug 1, 2006
Burn-in test apparatus for BGA packages using forced heat exhaust
SAMSUNG ELECTRONICS CO LTD15 citations82
US6960908B2Nov 1, 2005
Method for electrical testing of semiconductor package that detects socket defects in real time
SAMSUNG ELECTRONICS CO LTD14 citations82
US6462534B2Oct 8, 2002
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith
SAMSUNG ELECTRONICS CO LTD20 citations81
US7438563B2Oct 21, 2008
Connector for testing a semiconductor package
SAMSUNG ELECTRONICS CO LTD9 citations80
US7227351B2Jun 5, 2007
Apparatus and method for performing parallel test on integrated circuit devices
SAMSUNG ELECTRONICS CO LTD11 citations80
US8018899B2Sep 13, 2011
Handoff system and method between different kinds of devices, SIP server and operational method of SIP server
SAMSUNG ELECTRONICS CO LTD7 citations79
US6337695B1Jan 8, 2002
Circuit for controlling a contrast level and compensating a brightness level of a video display apparatus and method therefor
SAMSUNG ELECTRONICS CO LTD7 citations74
US6183589B1Feb 6, 2001
Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads
SAMSUNG ELECTRONICS CO LTD7 citations73
US6861682B2Mar 1, 2005
Laser link structure capable of preventing an upper crack and broadening an energy window of a laser beam, and fuse box using the same
SAMSUNG ELECTRONICS CO LTD7 citations72
US6850450B2Feb 1, 2005
Fuse box including make-link and redundant address decoder having the same, and method for repairing defective memory cell
SAMSUNG ELECTRONICS CO LTD10 citations72
US6201746B1Mar 13, 2001
Test method for high speed memory devices in which limit conditions for the clock are defined
SAMSUNG ELECTRONICS CO LTD9 citations71
US7254757B2Aug 7, 2007
Flash memory test system and method capable of test time reduction
SAMSUNG ELECTRONICS CO LTD7 citations70
US6943577B2Sep 13, 2005
Multichip package test
SAMSUNG ELECTRONICS CO LTD6 citations70
US6842031B2Jan 11, 2005
Method of electrically testing semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations66
US6710550B2Mar 23, 2004
Plasma display panel apparatus and method of protecting an over current thereof
SAMSUNG ELECTRONICS CO LTD5 citations63
US6686929B2Feb 3, 2004
Broadband switching drive compensating circuit for a video display device
SAMSUNG ELECTRONICS CO LTD4 citations63
US5942861AAug 24, 1999
Front/back porch voltage-regulator of vertical focus control signal
SAMSUNG ELECTRONICS CO LTD4 citations63
US5780978AJul 14, 1998
Vertical focusing circuit
SAMSUNG ELECTRONICS CO LTD5 citations63
US6507801B1Jan 14, 2003
Semiconductor device testing system
SAMSUNG ELECTRONICS CO LTD6 citations62
US7602172B2Oct 13, 2009
Test apparatus having multiple head boards at one handler and its test method
SAMSUNG ELECTRONICS CO LTD1 citations61
US7378864B2May 27, 2008
Test apparatus having multiple test sites at one handler and its test method
SAMSUNG ELECTRONICS CO LTD4 citations61
US7017428B2Mar 28, 2006
Test kit for semiconductor package and method for testing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations61
US7230417B2Jun 12, 2007
Test system of semiconductor device having a handler remote control and method of operating the same
SAMSUNG ELECTRONICS CO LTD5 citations60
US6841425B2Jan 11, 2005
Wafer treatment method for protecting fuse box of semiconductor chip
SAMSUNG ELECTRONICS CO LTD3 citations60
US7327154B2Feb 5, 2008
Multichip package test
SAMSUNG ELECTRONICS CO LTD3 citations59
US5940413AAug 17, 1999
Method for detecting operational errors in a tester for semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations58
US7492032B2Feb 17, 2009
Fuse regions of a semiconductor memory device and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations56
US6700337B2Mar 2, 2004
Apparatus for generating dynamic focus signal
SAMSUNG ELECTRONICS CO LTD0 citations52
US7408339B2Aug 5, 2008
Test system of semiconductor device having a handler remote control and method of operating the same
SAMSUNG ELECTRONICS CO LTD1 citations50
US6922050B2Jul 26, 2005
Method for testing a remnant batch of semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations50
US9426890B2Aug 23, 2016
Display apparatus
SAMSUNG ELECTRONICS CO LTD1 citations47
US6005357ADec 21, 1999
Vertical oscillation circuit for display device
SAMSUNG ELECTRONICS CO LTD0 citations42