P

Inventor

SHIOKAWA YOICHI

JP20 patents
⚠️ This page may combine multiple inventors who share the name “SHIOKAWA YOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EBARA CORP

17 patents
US11450544B2Sep 20, 2022

Substrate processing apparatus, substrate processing system, and substrate processing method

EBARA CORP8 citations86
US10665487B2May 26, 2020

Substrate processing apparatus, substrate processing system, and substrate processing method

EBARA CORP8 citations84
US8360817B2Jan 29, 2013

Polishing apparatus and polishing method

EBARA CORP7 citations80
US10399203B2Sep 3, 2019

Polishing method and polishing apparatus

EBARA CORP4 citations73
US10056277B2Aug 21, 2018

Polishing method

EBARA CORP2 citations73
US9999955B2Jun 19, 2018

Polishing apparatus and polished-state monitoring method

EBARA CORP4 citations73
US9550269B2Jan 24, 2017

Polishing device and polishing method

EBARA CORP2 citations73
US8965555B2Feb 24, 2015

Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus

EBARA CORP5 citations73
US12062563B2Aug 13, 2024

Substrate processing apparatus, substrate processing system, and substrate processing method

EBARA CORP0 citations62
US11951588B2Apr 9, 2024

Optical film-thickness measuring apparatus and polishing apparatus

EBARA CORP0 citations52
US11911867B2Feb 27, 2024

Polishing apparatus and polishing method

EBARA CORP0 citations52
US11833636B2Dec 5, 2023

Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate

EBARA CORP0 citations52
US12504273B2Dec 23, 2025

Measuring film-thickness of a workpiece in a semiconductor processing apparatus using a composite spectrum

EBARA CORP0 citations51
US12496677B2Dec 16, 2025

Polishing apparatus and polishing method

EBARA CORP0 citations51
US11495475B2Nov 8, 2022

Method of cleaning a substrate

EBARA CORP0 citations50
US11759913B2Sep 19, 2023

Polishing method and polishing apparatus

EBARA CORP0 citations48
US10556314B2Feb 11, 2020

Head height adjustment device and substrate processing apparatus provided with head height adjustment device

EBARA CORP0 citations39

SONE TADAKAZU

1 patent

FUKUDA AKIRA

1 patent

SHIOKAWA YOICHI

1 patent