Inventor

LYONS CHRISTOPHER F

US146 patents

⚠️ This page may combine multiple inventors who share the name “LYONS CHRISTOPHER F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LYONS CHRISTOPHER F

ADVANCED MICRO DEVICES INC

Modified film stack and patterning strategy for stress compensation and prevention of pattern distortion in amorphous carbon gate patterning

Spin on polymers for organic memory devices

Pellicle for use in EUV lithography and a method of making such a pellicle

Bi-layer trim etch process to form integrated circuit gate structures

Use of silicon containing imaging layer to define sub-resolution gate structures

RELACS process to double the frequency or pitch of small feature formation

Sidewall formation for sidewall patterning of sub 100 nm structures

Method using a thin resist mask for dual damascene stop layer etch

Stepper alignment mark structure for maintaining alignment integrity

Ultra-thin resist and nitride/oxide hard mask for metal etch

Photosensitive polymeric memory elements

Polymer memory device formed in via opening

Methods of forming passive layers in organic memory cells

Thin resist with transition metal hard mask for via etch application

Thin resist with nitride hard mask for gate etch application

CVD plasma process to fill contact hole in damascene process

Shallow trench isolation formation without planarization mask

Thin resist with amorphous silicon hard mask for via etch application

Shallow trench isolation formation with reduced polish stop thickness

Damascene process for a T-shaped gate electrode

Ion implantation to modulate amorphous carbon stress

Electrical critical dimension measurement and defect detection for reticle fabrication

Photosensitive polymeric memory elements

CVD organic polymer film for advanced gate patterning

High modulus filler for low k materials

Scatterometry of grating structures to monitor wafer stress

Dual damascene trench depth monitoring

Sensor to predict void free films using various grating structures and characterize fill performance

Quartz crystal monitor wafer for lithography and etch process monitoring

Controlling thermal expansion of mask substrates by scatterometry

Metal bridging monitor for etch and CMP endpoint detection

Chemical treatment to strengthen photoresists to prevent pattern collapse

Shallow trench isolation formation with ion implantation

Pellicle for use in small wavelength lithography and a method for making such a pellicle using polymer films

Dual inlaid process using a bilayer resist

Multilayer anti-reflective coating process for integrated circuit fabrication

Bright field image reversal for contact hole patterning

Use of silicon oxynitride ARC for metal layers

Ultra-thin resist and SiON/oxide hard mask for metal etch

Ultra-thin resist and barrier metal/oxide hard mask for metal etch

Ultra-thin resist and oxide/nitride hard mask for metal etch

Thin resist with transition metal hard mask for via etch application

Ultra-thin resist and silicon/oxide hard mask for metal etch

Shallow trench isolation formation with spacer-assisted ion implantation

IBM

Top antireflective coating film

Antireflective coating films

Mid and deep-UV antireflection coatings and methods for use thereof

Mid and deep-UV antireflection coatings and methods for use thereof

Mid and deep-uv antireflection coatings and methods for use thereof

Mid and deep-UV antireflection coatings and methods for use thereof