Inventor
OGAWA KENTA
JP28 patents
⚠️ This page may combine multiple inventors who share the name “OGAWA KENTA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
10 patentsUS8378470B2Feb 19, 2013
Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof
RENESAS ELECTRONICS CORP15 citations92
US7911038B2Mar 22, 2011
Wiring board, semiconductor device using wiring board and their manufacturing methods
RENESAS ELECTRONICS CORP7 citations84
US8357935B2Jan 22, 2013
Electronic component having an authentication pattern
RENESAS ELECTRONICS CORP3 citations54
US9666659B2May 30, 2017
External storage device and method of manufacturing external storage device
RENESAS ELECTRONICS CORP0 citations52
US9362263B2Jun 7, 2016
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
USRE45987EApr 26, 2016
Electronic component and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations52
US9165879B2Oct 20, 2015
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US8772914B2Jul 8, 2014
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US8753922B2Jun 17, 2014
Method of manufacturing a semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US7982303B2Jul 19, 2011
Semiconductor device and communication method
RENESAS ELECTRONICS CORP0 citations52
NEC ELECTRONICS CORP
6 patentsUS7745736B2Jun 29, 2010
Interconnecting substrate and semiconductor device
NEC ELECTRONICS CORP15 citations84
US7649749B2Jan 19, 2010
Wiring substrate, semiconductor device, and method of manufacturing the same
NEC ELECTRONICS CORP10 citations84
US6884523B2Apr 26, 2005
Electronic component and method of manufacturing the same
NEC ELECTRONICS CORP5 citations73
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
US7235309B2Jun 26, 2007
Electronic device having external terminals with lead-free metal thin film formed on the surface thereof
NEC ELECTRONICS CORP2 citations62
US7701726B2Apr 20, 2010
Method of manufacturing a wiring substrate and semiconductor device
NEC ELECTRONICS CORP1 citations52
KONAMI DIGITAL ENTERTAINMENT CO LTD
4 patentsUS11266904B2Mar 8, 2022
Game system, game control device, and information storage medium
KONAMI DIGITAL ENTERTAINMENT CO LTD5 citations69
US10857461B2Dec 8, 2020
Game control device, game system, and information storage medium
KONAMI DIGITAL ENTERTAINMENT CO LTD1 citations59
US10773154B2Sep 15, 2020
Game control device, game system, and information storage medium
KONAMI DIGITAL ENTERTAINMENT CO LTD0 citations48
US12491440B2Dec 9, 2025
Game system, medium, and method for determining ball speed and climb angle
KONAMI DIGITAL ENTERTAINMENT CO LTD0 citations45
NAKASHIBA YASUTAKA
3 patentsUS8810021B2Aug 19, 2014
Semiconductor device including a recess formed above a semiconductor chip
NAKASHIBA YASUTAKA3 citations62
US8283770B2Oct 9, 2012
Semiconductor device and communication method
NAKASHIBA YASUTAKA1 citations62
US8705238B2Apr 22, 2014
External storage device and method of manufacturing external storage device
NAKASHIBA YASUTAKA1 citations52