Inventor
MANTEGHI KAMRAN
US16 patents
⚠️ This page may combine multiple inventors who share the name “MANTEGHI KAMRAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VLSI TECHNOLOGY INC
12 patentsUS5689091ANov 18, 1997
Multi-layer substrate structure
VLSI TECHNOLOGY INC201 citations98
US5646831AJul 8, 1997
Electrically enhanced power quad flat pack arrangement
VLSI TECHNOLOGY INC239 citations98
US5854512ADec 29, 1998
High density leaded ball-grid array package
VLSI TECHNOLOGY INC98 citations97
US5710695AJan 20, 1998
Leadframe ball grid array package
VLSI TECHNOLOGY INC97 citations97
US5847455ADec 8, 1998
Molded leadframe ball grid array
VLSI TECHNOLOGY INC51 citations96
US6046075AApr 4, 2000
Oxide wire bond insulation in semiconductor assemblies
VLSI TECHNOLOGY INC26 citations92
US6033937AMar 7, 2000
Si O2 wire bond insulation in semiconductor assemblies
VLSI TECHNOLOGY INC27 citations92
US5863812AJan 26, 1999
Process for manufacturing a multi layer bumped semiconductor device
VLSI TECHNOLOGY INC31 citations92
US5800958ASep 1, 1998
Electrically enhanced power quad flat pack arrangement
VLSI TECHNOLOGY INC21 citations92
US5796038AAug 18, 1998
Technique to produce cavity-up HBGA packages
VLSI TECHNOLOGY INC37 citations92
US5661337AAug 26, 1997
Technique for improving bonding strength of leadframe to substrate in semiconductor IC chip packages
VLSI TECHNOLOGY INC35 citations92
US6040633AMar 21, 2000
Oxide wire bond insulation in semiconductor assemblies
VLSI TECHNOLOGY INC12 citations73
PHILIPS ELECTRONICS NA
3 patentsUS6177726B1Jan 23, 2001
SiO2 wire bond insulation in semiconductor assemblies
PHILIPS ELECTRONICS NA69 citations96
US6228683B1May 8, 2001
High density leaded ball-grid array package
PHILIPS ELECTRONICS NA31 citations92
US6083776AJul 4, 2000
Molded lead frame ball grid array
PHILIPS ELECTRONICS NA37 citations92