Inventor
QIN REYN
TW3 patents
Patents
3 patentsUS10297535B2May 21, 2019
Die package component with jumper structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR CO LTD1 citations55
US10312183B2Jun 4, 2019
Die package component with jumper structure
TAIWAN SEMICONDUCTOR CO LTD0 citations45
US10037964B1Jul 31, 2018
Die-packaging component with retaining structure for package body thereof
TAIWAN SEMICONDUCTOR CO LTD1 citations45