Inventor

PAVIER MARK

GB52 patents

⚠️ This page may combine multiple inventors who share the name “PAVIER MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAVIER MARK

INT RECTIFIER CORP

Power mosfet with integrated drivers in a common package

Embedded inductor for semiconductor device circuit

Back-to-back connected power semiconductor device package

Trench FET with non overlapping poly and remote contact therefor

Low profile package having multiple die

H-bridge with power switches and control in a single package

Clip-type lead frame for source mounted die

Device packages having a III-nitride based power semiconductor device

Half-bridge package

Dual semiconductor die package with reverse lead form

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Power converter package including vertically stacked driver IC

Semiconductor package with redistributed pads

Semiconductor device package with integrated heat spreader

Integrated semiconductor power device for multiple battery systems

Semiconductor package fabrication

Redistributed solder pads using etched lead frame

Power semiconductor die attach process using conductive adhesive film

Method for fabricating a semiconductor package with conductive carrier integrated heat spreader

Plural semiconductor devices in monolithic flip chip

Clip-type lead frame for source mounted die

Redistributed solder pads using etched lead frame

Semiconductor package with conductive carrier integrated heat spreader

Battery protection circuit with integrated passive components

Power semiconductor device with reduced contact resistance

Semiconductor device with reduced contact resistance

Power converter package including top-drain configured power FET

Semiconductor device package with integrated heat spreader

Power MOSFET with integrated drivers in a common package

Semiconductor device with reduced contact resistance

Surface mountable power components

Surface mountable power components

INFINEON TECHNOLOGIES AG

Molded package with chip carrier comprising brazed electrically conductive layers

Emitter package for a photoacoustic sensor

Semiconductor die being connected with a clip and a wire which is partially disposed under the clip

Wafer-level package sensor device

Methods of environmental protection for silicon MEMS structures in cavity packages

Molded package with chip carrier comprising brazed electrically conductive layers

Three level interconnect clip

Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation

PAVIER MARK

IMS formed as can for semiconductor housing

Autoclave capable chip-scale package

Semiconductor package including a semiconductor die having redistributed pads

Semiconductor package

INFINEON TECHNOLOGIES AMERICAS CORP

Method for fabricating a power semiconductor package including vertically stacked driver IC

Semiconductor package including a semiconductor die having redistributed pads

Method for fabricating a semiconductor package with conductive carrier integrated heat spreader

Power semiconductor package having vertically stacked driver IC

FUCHS SVEN

Semiconductor device with reduced contact resistance

FARLOW ANDY

Chip-scale package