Inventor
LIM HANJIN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “LIM HANJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS9673272B2Jun 6, 2017
Semiconductor device including capacitor and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US9337149B2May 10, 2016
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD16 citations82
US9305928B2Apr 5, 2016
Semiconductor devices having a silicon-germanium channel layer and methods of forming the same
SAMSUNG ELECTRONICS CO LTD11 citations79
US10892345B2Jan 12, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US12581642B2Mar 17, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12507397B2Dec 23, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12057470B2Aug 6, 2024
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US10930654B2Feb 23, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11764283B2Sep 19, 2023
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US11621339B2Apr 4, 2023
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US11114541B2Sep 7, 2021
Semiconductor device including capacitor
SAMSUNG ELECTRONICS CO LTD0 citations61
US12336202B2Jun 17, 2025
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations60
US12557308B2Feb 17, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US12199138B2Jan 14, 2025
Semiconductor device including capacitor structure and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US12568629B2Mar 3, 2026
Semiconductor device including a capacitor structure with a dielectric layer structure
SAMSUNG ELECTRONICS CO LTD0 citations52
US12598760B2Apr 7, 2026
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US12575119B2Mar 10, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12334308B2Jun 17, 2025
Batch-type apparatus for atomic layer etching (ALE), and ALE method and semiconductor device manufacturing method based on the same apparatus
SAMSUNG ELECTRONICS CO LTD0 citations51
US11978704B2May 7, 2024
Wiring structure and electronic device employing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11901291B2Feb 13, 2024
Semiconductor devices including lower electrodes including inner protective layer and outer protective layer
SAMSUNG ELECTRONICS CO LTD0 citations50
US12527015B2Jan 13, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations49
US12295136B2May 6, 2025
Integrated circuit semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations49
US11784213B2Oct 10, 2023
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD0 citations48
US9685318B2Jun 20, 2017
Method of forming semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations48
US9812332B2Nov 7, 2017
Etching methods and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations44
US12501603B2Dec 16, 2025
Capacitor structure and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD0 citations41