P

Inventor

LIM HANJIN

KR27 patents
⚠️ This page may combine multiple inventors who share the name “LIM HANJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

26 patents
US9673272B2Jun 6, 2017

Semiconductor device including capacitor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US9337149B2May 10, 2016

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD16 citations82
US9305928B2Apr 5, 2016

Semiconductor devices having a silicon-germanium channel layer and methods of forming the same

SAMSUNG ELECTRONICS CO LTD11 citations79
US10892345B2Jan 12, 2021

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations72
US12581642B2Mar 17, 2026

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US12507397B2Dec 23, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US12057470B2Aug 6, 2024

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations62
US10930654B2Feb 23, 2021

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations62
US11764283B2Sep 19, 2023

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US11621339B2Apr 4, 2023

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US11114541B2Sep 7, 2021

Semiconductor device including capacitor

SAMSUNG ELECTRONICS CO LTD0 citations61
US12336202B2Jun 17, 2025

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations60
US12557308B2Feb 17, 2026

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations59
US12199138B2Jan 14, 2025

Semiconductor device including capacitor structure and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations56
US12568629B2Mar 3, 2026

Semiconductor device including a capacitor structure with a dielectric layer structure

SAMSUNG ELECTRONICS CO LTD0 citations52
US12598760B2Apr 7, 2026

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US12575119B2Mar 10, 2026

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations51
US12334308B2Jun 17, 2025

Batch-type apparatus for atomic layer etching (ALE), and ALE method and semiconductor device manufacturing method based on the same apparatus

SAMSUNG ELECTRONICS CO LTD0 citations51
US11978704B2May 7, 2024

Wiring structure and electronic device employing the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US11901291B2Feb 13, 2024

Semiconductor devices including lower electrodes including inner protective layer and outer protective layer

SAMSUNG ELECTRONICS CO LTD0 citations50
US12527015B2Jan 13, 2026

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations49
US12295136B2May 6, 2025

Integrated circuit semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations49
US11784213B2Oct 10, 2023

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD0 citations48
US9685318B2Jun 20, 2017

Method of forming semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations48
US9812332B2Nov 7, 2017

Etching methods and methods of manufacturing semiconductor devices using the same

SAMSUNG ELECTRONICS CO LTD0 citations44
US12501603B2Dec 16, 2025

Capacitor structure and semiconductor device including the same

SAMSUNG ELECTRONICS CO LTD0 citations41

PARK KIYEON

1 patent